No-clean And Water-clean Mass Reflow Processes Of 0.4 mm Pitch, 256-Pin Fine Pitch Quad Flat Packs (QFP)

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Bibliographic Details
Main Authors:	Lau, J., Govila, R., Larner, C., Yi-Hsin Pao, Erasmus, S., Dolot, S., Solberg, V.
Format:	Conference Proceeding
Language:	English
Subjects:	and manufacturing technology Components Copper Electronic packaging thermal management Electronics packaging Lead packaging Plastics Scanning electron microscopy Soldering Solvents Space technology
Online Access:	Request full text
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DOI:	10.1109/IEMT.1992.639909