No-clean And Water-clean Mass Reflow Processes Of 0.4 mm Pitch, 256-Pin Fine Pitch Quad Flat Packs (QFP)

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Bibliographic Details
Main Authors: Lau, J., Govila, R., Larner, C., Yi-Hsin Pao, Erasmus, S., Dolot, S., Solberg, V.
Format: Conference Proceeding
Language:English
Subjects:
and manufacturing technology
Components
Copper
Electronic packaging thermal management
Electronics packaging
Lead
packaging
Plastics
Scanning electron microscopy
Soldering
Solvents
Space technology
Online Access:Request full text
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DOI:10.1109/IEMT.1992.639909