Hybrid pressure-tolerant electronics

When working in deep-sea environments, the ambient pressure of the water column causes special design effort on the integration of electronic components for robotic structures. Until recently, electronic modules required housings which allowed the use of electronics at pressure conditions like they...

Full description

Saved in:
Bibliographic Details
Main Authors: Kampmann, P., Lemburg, J., Hanff, H., Kirchner, F.
Format: Conference Proceeding
Language:English
Subjects:
Cameras
Deep-Sea
Electronic components
Electronics
Housing
Micromechanical devices
Oscillators
Plastics
Pressure Tolerant
Robots
Water column
Citations: Items that cite this one
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:When working in deep-sea environments, the ambient pressure of the water column causes special design effort on the integration of electronic components for robotic structures. Until recently, electronic modules required housings which allowed the use of electronics at pressure conditions like they are on land. These housings increased the costs and the dimensions of the overall system as those modules are bulky and expensive to manufacture. Other ways have to be taken when designing miniaturized components. A hybrid approach between pressure tolerant systems design and pressure hulls enables the realization of miniaturized and cost-effective components for deep-sea.
ISSN:0197-7385
DOI:10.1109/OCEANS.2012.6404828