A novel and simple fabrication technology for high power module with enhanced thermal performance

A novel packaging method for high power modules based on one-step sintering process using a proper jig and nano silver paste is described. First, using Ansoft Q3D Extractor, electromagnetic simulation is carried out to design the best chip array and DC bus connection, which giving the lowest stray i...

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Bibliographic Details
Main Authors: Younghun Byun, Changmo Jeong, Jeong-Won Yoon, Che-Heung Kim, Chang-Sik Kim, Baik-Woo Lee, SeongWoon Booh, U-In chung
Format: Conference Proceeding
Language:English
Subjects:
Arrays
Coolants
Lead
Pins
Online Access:Request full text
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Summary:A novel packaging method for high power modules based on one-step sintering process using a proper jig and nano silver paste is described. First, using Ansoft Q3D Extractor, electromagnetic simulation is carried out to design the best chip array and DC bus connection, which giving the lowest stray inductance. A die-bonder is used for a precise die attachment, which provides high placement accuracy (
ISSN:1938-8756
DOI:10.1109/VPPC.2012.6422503