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Multiple Module Pixellated CdTe Spectroscopic X-Ray Detector
A pixellated CdTe detector system comprising 2×2 detector modules has been developed for high energy spectroscopic X-ray imaging applications and has an active area of 16 cm 2 . The detector modules are made from the HEXITEC 80×80 ASIC and 1 mm thick CdTe with Al-Schottky contacts. The CdTe has 250...
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Published in: | IEEE transactions on nuclear science 2013-04, Vol.60 (2), p.1197-1200 |
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container_title | IEEE transactions on nuclear science |
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creator | Wilson, M. D. Bell, S. J. Cernik, R. J. Christodoulou, C. Egan, C. K. O'Flynn, D. Jacques, S. Pani, S. Scuffham, J. Seller, P. Sellin, P. J. Speller, R. Veale, M. C. |
description | A pixellated CdTe detector system comprising 2×2 detector modules has been developed for high energy spectroscopic X-ray imaging applications and has an active area of 16 cm 2 . The detector modules are made from the HEXITEC 80×80 ASIC and 1 mm thick CdTe with Al-Schottky contacts. The CdTe has 250 μm pitch pixels with an outer guard ring on the same pitch. The single HEXITEC 80×80 detectors have an average energy resolution (FWHM) of 800 eV at 59.9 keV. Limitations in the multiple module DAQ system mean that the energy resolution of the pixels in the 2×2 detector array is 2.0 keV at 59.9 keV. The spacing between the tiled detector modules is 150 μm which results in an inactive area equivalent to 3 pixels, including the guard ring on the edge of the detectors. The modular detector configuration demonstrates the potential to create large area detector arrays in the future. |
doi_str_mv | 10.1109/TNS.2013.2240694 |
format | article |
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Limitations in the multiple module DAQ system mean that the energy resolution of the pixels in the 2×2 detector array is 2.0 keV at 59.9 keV. The spacing between the tiled detector modules is 150 μm which results in an inactive area equivalent to 3 pixels, including the guard ring on the edge of the detectors. The modular detector configuration demonstrates the potential to create large area detector arrays in the future.</description><identifier>ISSN: 0018-9499</identifier><identifier>EISSN: 1558-1578</identifier><identifier>DOI: 10.1109/TNS.2013.2240694</identifier><identifier>CODEN: IETNAE</identifier><language>eng</language><publisher>IEEE</publisher><subject>Application specific integrated circuits ; Arrays ; CdTe ; CdZnTe ; Data acquisition ; Detectors ; Image edge detection ; Image quality ; Imaging ; spectroscopic ; X-ray detector</subject><ispartof>IEEE transactions on nuclear science, 2013-04, Vol.60 (2), p.1197-1200</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c263t-1ac24d4d05aa213ba61cc196d7fc44a72038e9b14bbc1d8c1bab773b8baf239f3</citedby><cites>FETCH-LOGICAL-c263t-1ac24d4d05aa213ba61cc196d7fc44a72038e9b14bbc1d8c1bab773b8baf239f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6457433$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,54796</link.rule.ids></links><search><creatorcontrib>Wilson, M. D.</creatorcontrib><creatorcontrib>Bell, S. J.</creatorcontrib><creatorcontrib>Cernik, R. J.</creatorcontrib><creatorcontrib>Christodoulou, C.</creatorcontrib><creatorcontrib>Egan, C. K.</creatorcontrib><creatorcontrib>O'Flynn, D.</creatorcontrib><creatorcontrib>Jacques, S.</creatorcontrib><creatorcontrib>Pani, S.</creatorcontrib><creatorcontrib>Scuffham, J.</creatorcontrib><creatorcontrib>Seller, P.</creatorcontrib><creatorcontrib>Sellin, P. J.</creatorcontrib><creatorcontrib>Speller, R.</creatorcontrib><creatorcontrib>Veale, M. C.</creatorcontrib><title>Multiple Module Pixellated CdTe Spectroscopic X-Ray Detector</title><title>IEEE transactions on nuclear science</title><addtitle>TNS</addtitle><description>A pixellated CdTe detector system comprising 2×2 detector modules has been developed for high energy spectroscopic X-ray imaging applications and has an active area of 16 cm 2 . The detector modules are made from the HEXITEC 80×80 ASIC and 1 mm thick CdTe with Al-Schottky contacts. The CdTe has 250 μm pitch pixels with an outer guard ring on the same pitch. The single HEXITEC 80×80 detectors have an average energy resolution (FWHM) of 800 eV at 59.9 keV. Limitations in the multiple module DAQ system mean that the energy resolution of the pixels in the 2×2 detector array is 2.0 keV at 59.9 keV. The spacing between the tiled detector modules is 150 μm which results in an inactive area equivalent to 3 pixels, including the guard ring on the edge of the detectors. The modular detector configuration demonstrates the potential to create large area detector arrays in the future.</description><subject>Application specific integrated circuits</subject><subject>Arrays</subject><subject>CdTe</subject><subject>CdZnTe</subject><subject>Data acquisition</subject><subject>Detectors</subject><subject>Image edge detection</subject><subject>Image quality</subject><subject>Imaging</subject><subject>spectroscopic</subject><subject>X-ray detector</subject><issn>0018-9499</issn><issn>1558-1578</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNo9j0tLxDAUhYMoWEf3gpv-gdTcPJoE3Eh1VJhRcSq4C3kVKpWWtgPOvzfDDK4O93DO5XwIXQMpAIi-rV83BSXACko5KTU_QRkIoTAIqU5RRggorLnW5-himr7TyQURGbpbb7u5HbqYr_uwTfLe_saus3MMeRXqmG-G6Oexn3w_tD7_wh92lz_EOZn9eInOGttN8eqoC_S5fKyrZ7x6e3qp7lfY05LNGKynPPBAhLUUmLMleA-6DLLxnFtJCVNRO-DOeQjKg7NOSuaUsw1lumELRA5_fRoyjbExw9j-2HFngJg9vUn0Zk9vjvSpcnOotDHG_3jJheSMsT8qt1ZF</recordid><startdate>20130401</startdate><enddate>20130401</enddate><creator>Wilson, M. D.</creator><creator>Bell, S. J.</creator><creator>Cernik, R. J.</creator><creator>Christodoulou, C.</creator><creator>Egan, C. K.</creator><creator>O'Flynn, D.</creator><creator>Jacques, S.</creator><creator>Pani, S.</creator><creator>Scuffham, J.</creator><creator>Seller, P.</creator><creator>Sellin, P. J.</creator><creator>Speller, R.</creator><creator>Veale, M. C.</creator><general>IEEE</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20130401</creationdate><title>Multiple Module Pixellated CdTe Spectroscopic X-Ray Detector</title><author>Wilson, M. D. ; Bell, S. J. ; Cernik, R. J. ; Christodoulou, C. ; Egan, C. K. ; O'Flynn, D. ; Jacques, S. ; Pani, S. ; Scuffham, J. ; Seller, P. ; Sellin, P. J. ; Speller, R. ; Veale, M. 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K.</creatorcontrib><creatorcontrib>O'Flynn, D.</creatorcontrib><creatorcontrib>Jacques, S.</creatorcontrib><creatorcontrib>Pani, S.</creatorcontrib><creatorcontrib>Scuffham, J.</creatorcontrib><creatorcontrib>Seller, P.</creatorcontrib><creatorcontrib>Sellin, P. J.</creatorcontrib><creatorcontrib>Speller, R.</creatorcontrib><creatorcontrib>Veale, M. C.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Xplore</collection><collection>CrossRef</collection><jtitle>IEEE transactions on nuclear science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wilson, M. D.</au><au>Bell, S. J.</au><au>Cernik, R. J.</au><au>Christodoulou, C.</au><au>Egan, C. K.</au><au>O'Flynn, D.</au><au>Jacques, S.</au><au>Pani, S.</au><au>Scuffham, J.</au><au>Seller, P.</au><au>Sellin, P. J.</au><au>Speller, R.</au><au>Veale, M. C.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Multiple Module Pixellated CdTe Spectroscopic X-Ray Detector</atitle><jtitle>IEEE transactions on nuclear science</jtitle><stitle>TNS</stitle><date>2013-04-01</date><risdate>2013</risdate><volume>60</volume><issue>2</issue><spage>1197</spage><epage>1200</epage><pages>1197-1200</pages><issn>0018-9499</issn><eissn>1558-1578</eissn><coden>IETNAE</coden><abstract>A pixellated CdTe detector system comprising 2×2 detector modules has been developed for high energy spectroscopic X-ray imaging applications and has an active area of 16 cm 2 . The detector modules are made from the HEXITEC 80×80 ASIC and 1 mm thick CdTe with Al-Schottky contacts. The CdTe has 250 μm pitch pixels with an outer guard ring on the same pitch. The single HEXITEC 80×80 detectors have an average energy resolution (FWHM) of 800 eV at 59.9 keV. Limitations in the multiple module DAQ system mean that the energy resolution of the pixels in the 2×2 detector array is 2.0 keV at 59.9 keV. The spacing between the tiled detector modules is 150 μm which results in an inactive area equivalent to 3 pixels, including the guard ring on the edge of the detectors. The modular detector configuration demonstrates the potential to create large area detector arrays in the future.</abstract><pub>IEEE</pub><doi>10.1109/TNS.2013.2240694</doi><tpages>4</tpages></addata></record> |
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language | eng |
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source | IEEE Electronic Library (IEL) Journals |
subjects | Application specific integrated circuits Arrays CdTe CdZnTe Data acquisition Detectors Image edge detection Image quality Imaging spectroscopic X-ray detector |
title | Multiple Module Pixellated CdTe Spectroscopic X-Ray Detector |
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