LCP Characterization of Broadband RF Performance With Consideration of Fabrication Tolerances for CSLP Substrate Suitability

This paper discusses the development of a chip scale level package substrate using liquid crystal polymer (LCP) laminates to support wideband millimeter-wave transmission lines and layer-to-layer transitions. To evaluate the reproducibility of RF performance on LCP in large-panel processing, an iter...

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2013-04, Vol.3 (4), p.696-707
Main Authors: Patterson, Chad E., Ajoian, J. V., Papapolymerou, J., May, G. S.
Format: Article
Language:English
Subjects:
Design for manufacturability
Fabrication
Impedance
layered manufacturing
Metals
organic materials
Power transmission lines
Radio frequency
Substrates
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Summary:This paper discusses the development of a chip scale level package substrate using liquid crystal polymer (LCP) laminates to support wideband millimeter-wave transmission lines and layer-to-layer transitions. To evaluate the reproducibility of RF performance on LCP in large-panel processing, an iterative design, simulation, fabrication, and test cycle is implemented. Inspection and verification methods are utilized to correlate variation in fabrication tolerances with simulation performance. With subsequent evaluations of fabricated substrates, a database is compiled to update design models and provide an estimate of RF performance yield based on fabrication tolerances. For the first time, a statistical analysis is presented for large-panel LCP fabrication tolerances using printed circuit board supplier techniques.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2013.2247465