Deflection routing in 3D Network-on-Chip with TSV serialization

This paper proposes a deflection routing for 3D NoC with serialized TSVs. Bufferless deflection routing provides area- and power-efficient communication under low to medium traffic load. Under 3D circumstances, the bufferless deflection routing can yield even better performance than buffered routing...

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Bibliographic Details
Main Authors: Jinho Lee, Dongwoo Lee, Sunwook Kim, Kiyoung Choi
Format: Conference Proceeding
Language:English
Subjects:
Bandwidth
Ports (Computers)
Routing
System recovery
Three-dimensional displays
Through-silicon vias
Throughput
Online Access:Request full text
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Description
Summary:This paper proposes a deflection routing for 3D NoC with serialized TSVs. Bufferless deflection routing provides area- and power-efficient communication under low to medium traffic load. Under 3D circumstances, the bufferless deflection routing can yield even better performance than buffered routing when key aspects are properly taken into account. Evaluation of the proposed scheme shows its effectiveness in throughput, latency, and energy consumption.
ISSN:2153-6961
2153-697X
DOI:10.1109/ASPDAC.2013.6509554