Highlights of iNEMI 2013 technology roadmaps

iNEMI (International Electronics Manufacturing Initiative) has been creating and exploiting technology roadmaps for the electronics industry for 20 years. It has become recognized as an important tool for defining the "state of the art" in the electronics industry as well as identifying em...

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Main Authors: Pfahl, B., Fu, H., Richardson, C.
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Richardson, C.
description iNEMI (International Electronics Manufacturing Initiative) has been creating and exploiting technology roadmaps for the electronics industry for 20 years. It has become recognized as an important tool for defining the "state of the art" in the electronics industry as well as identifying emerging and disruptive technologies. It also includes keys to developing future iNEMI projects and setting industry R&D priorities over the next 10 years. The roadmap is updated every two years with global participation from the industry. The 2013 version of iNEMI roadmap will be released to the public in March 2013. This paper provides a preview of the electronics industry paradigm shifts and the key technology developments and issues. It focuses on the Organic Packaging and Organic PCB Roadmaps, and on the Gap Analysis Process and Resulting iNEMI Actions.
doi_str_mv 10.1109/IEMT.2012.6521822
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fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_6521822</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6521822</ieee_id><sourcerecordid>6521822</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-d149bb2ad90f2ecc01ac92cee9247994480ecc2592486e7422fc809dd7b3affd3</originalsourceid><addsrcrecordid>eNo1T0tOwzAUND-JtPQAiE0OQMLzs2P7LVEVaKQWNmVdOf60QSmpkmx6eyJRFqPRzEgzGsYeOeScA71U5WabI3DMVYHcIF6xGZdKCymMwmuWYKFVRgrVDVuQNv-ZNLcs4WAoM5zgns2G4RsAAaRO2POq2R_aCeOQdjFtPspNlU4jIh2DO_x0bbc_p31n_dGehgd2F207hMWF5-zrrdwuV9n6871avq6zhutizDyXVNdoPUHE4Bxw6whdCIRSE0lpYHKxmKRRQUvE6AyQ97oWNkYv5uzpr7cJIexOfXO0_Xl3eS1-AeRaRWI</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Highlights of iNEMI 2013 technology roadmaps</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Pfahl, B. ; Fu, H. ; Richardson, C.</creator><creatorcontrib>Pfahl, B. ; Fu, H. ; Richardson, C.</creatorcontrib><description>iNEMI (International Electronics Manufacturing Initiative) has been creating and exploiting technology roadmaps for the electronics industry for 20 years. It has become recognized as an important tool for defining the "state of the art" in the electronics industry as well as identifying emerging and disruptive technologies. It also includes keys to developing future iNEMI projects and setting industry R&amp;D priorities over the next 10 years. The roadmap is updated every two years with global participation from the industry. The 2013 version of iNEMI roadmap will be released to the public in March 2013. This paper provides a preview of the electronics industry paradigm shifts and the key technology developments and issues. It focuses on the Organic Packaging and Organic PCB Roadmaps, and on the Gap Analysis Process and Resulting iNEMI Actions.</description><identifier>ISSN: 1089-8190</identifier><identifier>ISBN: 9781467343848</identifier><identifier>ISBN: 1467343846</identifier><identifier>EISSN: 2576-9626</identifier><identifier>EISBN: 1467343862</identifier><identifier>EISBN: 9781467343862</identifier><identifier>DOI: 10.1109/IEMT.2012.6521822</identifier><language>eng</language><publisher>IEEE</publisher><ispartof>2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2012, p.1-5</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6521822$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6521822$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Pfahl, B.</creatorcontrib><creatorcontrib>Fu, H.</creatorcontrib><creatorcontrib>Richardson, C.</creatorcontrib><title>Highlights of iNEMI 2013 technology roadmaps</title><title>2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)</title><addtitle>IEMT</addtitle><description>iNEMI (International Electronics Manufacturing Initiative) has been creating and exploiting technology roadmaps for the electronics industry for 20 years. It has become recognized as an important tool for defining the "state of the art" in the electronics industry as well as identifying emerging and disruptive technologies. It also includes keys to developing future iNEMI projects and setting industry R&amp;D priorities over the next 10 years. The roadmap is updated every two years with global participation from the industry. The 2013 version of iNEMI roadmap will be released to the public in March 2013. This paper provides a preview of the electronics industry paradigm shifts and the key technology developments and issues. It focuses on the Organic Packaging and Organic PCB Roadmaps, and on the Gap Analysis Process and Resulting iNEMI Actions.</description><issn>1089-8190</issn><issn>2576-9626</issn><isbn>9781467343848</isbn><isbn>1467343846</isbn><isbn>1467343862</isbn><isbn>9781467343862</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2012</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNo1T0tOwzAUND-JtPQAiE0OQMLzs2P7LVEVaKQWNmVdOf60QSmpkmx6eyJRFqPRzEgzGsYeOeScA71U5WabI3DMVYHcIF6xGZdKCymMwmuWYKFVRgrVDVuQNv-ZNLcs4WAoM5zgns2G4RsAAaRO2POq2R_aCeOQdjFtPspNlU4jIh2DO_x0bbc_p31n_dGehgd2F207hMWF5-zrrdwuV9n6871avq6zhutizDyXVNdoPUHE4Bxw6whdCIRSE0lpYHKxmKRRQUvE6AyQ97oWNkYv5uzpr7cJIexOfXO0_Xl3eS1-AeRaRWI</recordid><startdate>201211</startdate><enddate>201211</enddate><creator>Pfahl, B.</creator><creator>Fu, H.</creator><creator>Richardson, C.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>201211</creationdate><title>Highlights of iNEMI 2013 technology roadmaps</title><author>Pfahl, B. ; Fu, H. ; Richardson, C.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-d149bb2ad90f2ecc01ac92cee9247994480ecc2592486e7422fc809dd7b3affd3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2012</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Pfahl, B.</creatorcontrib><creatorcontrib>Fu, H.</creatorcontrib><creatorcontrib>Richardson, C.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library Online</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Pfahl, B.</au><au>Fu, H.</au><au>Richardson, C.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Highlights of iNEMI 2013 technology roadmaps</atitle><btitle>2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)</btitle><stitle>IEMT</stitle><date>2012-11</date><risdate>2012</risdate><spage>1</spage><epage>5</epage><pages>1-5</pages><issn>1089-8190</issn><eissn>2576-9626</eissn><isbn>9781467343848</isbn><isbn>1467343846</isbn><eisbn>1467343862</eisbn><eisbn>9781467343862</eisbn><abstract>iNEMI (International Electronics Manufacturing Initiative) has been creating and exploiting technology roadmaps for the electronics industry for 20 years. It has become recognized as an important tool for defining the "state of the art" in the electronics industry as well as identifying emerging and disruptive technologies. It also includes keys to developing future iNEMI projects and setting industry R&amp;D priorities over the next 10 years. The roadmap is updated every two years with global participation from the industry. The 2013 version of iNEMI roadmap will be released to the public in March 2013. This paper provides a preview of the electronics industry paradigm shifts and the key technology developments and issues. It focuses on the Organic Packaging and Organic PCB Roadmaps, and on the Gap Analysis Process and Resulting iNEMI Actions.</abstract><pub>IEEE</pub><doi>10.1109/IEMT.2012.6521822</doi><tpages>5</tpages></addata></record>
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2576-9626
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title Highlights of iNEMI 2013 technology roadmaps
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T16%3A39%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Highlights%20of%20iNEMI%202013%20technology%20roadmaps&rft.btitle=2012%2035th%20IEEE/CPMT%20International%20Electronics%20Manufacturing%20Technology%20Conference%20(IEMT)&rft.au=Pfahl,%20B.&rft.date=2012-11&rft.spage=1&rft.epage=5&rft.pages=1-5&rft.issn=1089-8190&rft.eissn=2576-9626&rft.isbn=9781467343848&rft.isbn_list=1467343846&rft_id=info:doi/10.1109/IEMT.2012.6521822&rft.eisbn=1467343862&rft.eisbn_list=9781467343862&rft_dat=%3Cieee_6IE%3E6521822%3C/ieee_6IE%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-i175t-d149bb2ad90f2ecc01ac92cee9247994480ecc2592486e7422fc809dd7b3affd3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=6521822&rfr_iscdi=true