Development of low temperature curable positive tone photosensitive dielectric material

• Main Authors: Tanimoto, A., Abe, K., Nobe, S., Matsutani, H.
• Format: Conference Proceeding
• Language: English
• DOI: 10.1109/ICSJ.2012.6523450

Recently, low temperature curable photosensitive dielectric materials are attracting much attention in semiconductor package application to avoid thermal damages of the semiconductor devices. AH-1000 is a low temperature curable positive tone photo- definable material. In this paper, we report the mechanical, thermal, and adhesion property of AH-1000 together with its chemical resistance. A wafer level package (WLP) using AH-1000 as redistribution layers indicates that AH-1000 has enough mechanical toughness. It also suggests that higher elongation and lower Young's modulus are effective to eliminate mechanical stress to solder balls for dielectrics.