Peculiarities of multichip micro module frameless design with ball contacts on the flexible board

New design and technological solution of three-dimensional multi-chip modules has been considered. Installation of bare chips on a flexible board has been done by printed circuit board assembly and external module contacts have performed in the matrix ball pins form. Test program was conducted in or...

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Bibliographic Details
Main Authors: Vertyanov, D. V., Tikhonov, K. S., Timoshenkov, S. P., Petrov, V. S., Blinov, G. A.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Crystals
flexible board
flip-chip
Flip-chip devices
golden ball pins
multichip module
Pins
Printed circuits
Random access memory
Reliability
three-dimensional assembly
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Description
Summary:New design and technological solution of three-dimensional multi-chip modules has been considered. Installation of bare chips on a flexible board has been done by printed circuit board assembly and external module contacts have performed in the matrix ball pins form. Test program was conducted in order to quantify the limits of the process. Application of flip-chip process to a wide range of customers particularly for 3D packaging has been discussed.
DOI:10.1109/ELNANO.2013.6552038