RF-MEMS devices packaging by using quartz caps and epoxy polymer sealing rings

This work reports on RF MEMS chip capping to protect sensitive devices by quartz caps having a cavity to enclose MEMS devices and an epoxy dry film polymer as a sealing ring. The fabrication process for both die-to-die and wafer-to-wafer 0-level capping is presented. Good adhesion of caps to the sub...

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Bibliographic Details
Main Authors: Giacomozzi, Flavio, Mulloni, Viviana, Colpo, Sabrina, Faes, Alessandro, Sordo, Guido, Girardi, Stefano
Format: Conference Proceeding
Language:English
Subjects:
Cavity resonators
chip capping
Coplanar waveguides
dry film
epoxy polymer
Micromechanical devices
Polymers
Radio frequency
RF MEMS
Substrates
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Summary:This work reports on RF MEMS chip capping to protect sensitive devices by quartz caps having a cavity to enclose MEMS devices and an epoxy dry film polymer as a sealing ring. The fabrication process for both die-to-die and wafer-to-wafer 0-level capping is presented. Good adhesion of caps to the substrate is demonstrated by shear tests, while RF measurements on CPW lines indicate a negligible insertion loss increase. Capping of both capacitive and ohmic switches is reported showing no loss of functionality but a modification of actuation voltage induced by thermal treatment.