Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules

This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package Vias (TPVs) to realize 3D Integrated Passive and Actives Component (IPAC) concept. Miniaturization is achieved through; a) ultra-thin glass, b) low-loss thin dielectrics and...

Full description

Saved in:
Bibliographic Details
Main Authors: Sato, Yoichiro, Sitaraman, Srikrishna, Sukumaran, Vijay, Chou, Bruce, Junki Min, Ono, Motoshi, Karoui, Choukri, Dosseul, Franck, Nopper, Christian, Swaminathan, Madhavan, Sundaram, Venky, Tummala, Rao
Format: Conference Proceeding
Language:English
Subjects:
glass interposer
RF passive components
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package Vias (TPVs) to realize 3D Integrated Passive and Actives Component (IPAC) concept. Miniaturization is achieved through; a) ultra-thin glass, b) low-loss thin dielectrics and c) small TPVs. Inductors, capacitors and low pass filters functioning in the frequency range of 0.8 GHz to 5.4 GHz were modeled and fabricated between thin dielectric layers on 100 μm thin glass, and then assembled on PCB through BGA interconnections. The simulated results corroborated well with measured results, providing guidelines for RF module fabrication.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2013.6575795