Ethylene-Vinyl Acetate as a low cost encapsulant for hybrid electronic and fluidic circuits

We have developed a novel process that uses Ethylene-Vinyl Acetate (EVA) films to realize low cost integrated microfluidic systems in small packages. The EVA acts as both a final package for the device as well as a functional material for hosting molded microfluidic channels and optical structures s...

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Main Authors: Babikian, Sarkis, Cox-Muranami, Wesley A., Nelson, Edward, Li, G. P., Bachman, Mark
Format: Conference Proceeding
Language:English
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Adhesives
Cells (biology)
Microfluidics
Packaging
Substrates
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creator Babikian, Sarkis
Cox-Muranami, Wesley A.
Nelson, Edward
Li, G. P.
Bachman, Mark
description We have developed a novel process that uses Ethylene-Vinyl Acetate (EVA) films to realize low cost integrated microfluidic systems in small packages. The EVA acts as both a final package for the device as well as a functional material for hosting molded microfluidic channels and optical structures such as waveguides. In this paper we describe the lamination based packaging of microfluidics, characterize the adhesion strength between layers of the device and investigate the biocompatibility of EVA for microfluidic applications.
doi_str_mv 10.1109/ECTC.2013.6575820
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fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_6575820</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6575820</ieee_id><sourcerecordid>6575820</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-a814b939b11d3c11248cc52ab4fb5ec2cf78d2abdaa22534f7ed93f0bc7b44a53</originalsourceid><addsrcrecordid>eNo1kMlqwzAYhNUNmqR5gNKLXsCpVss6BpMuEOgl7aWHIP2SiIpqB0uh-O1raHqaGT4YhkHonpIVpUQ_btpdu2KE8lUtlWwYuUBzKpTWhHHGLtGMcaUqqVh9hZZaNf-Mk2s0I7LWlZSE36J5zl-ECEJoM0Ofm3IYk-989RG7MeE1-GKKxyZjg1P_g6HPBfsOzDGfkukKDv2AD6MdosM-eShD30XApnM4pFN0k4c4wCmWfIdugknZL8-6QO9Pm137Um3fnl_b9baKVMlSmWmp1VxbSh0HSploACQzVgQrPTAIqnFTdMYwJrkIyjvNA7GgrBBG8gV6-OuN3vv9cYjfZhj355P4L3z_WEQ</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Ethylene-Vinyl Acetate as a low cost encapsulant for hybrid electronic and fluidic circuits</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Babikian, Sarkis ; Cox-Muranami, Wesley A. ; Nelson, Edward ; Li, G. P. ; Bachman, Mark</creator><creatorcontrib>Babikian, Sarkis ; Cox-Muranami, Wesley A. ; Nelson, Edward ; Li, G. P. ; Bachman, Mark</creatorcontrib><description>We have developed a novel process that uses Ethylene-Vinyl Acetate (EVA) films to realize low cost integrated microfluidic systems in small packages. The EVA acts as both a final package for the device as well as a functional material for hosting molded microfluidic channels and optical structures such as waveguides. In this paper we describe the lamination based packaging of microfluidics, characterize the adhesion strength between layers of the device and investigate the biocompatibility of EVA for microfluidic applications.</description><identifier>ISSN: 0569-5503</identifier><identifier>ISBN: 9781479902330</identifier><identifier>ISBN: 1479902330</identifier><identifier>EISSN: 2377-5726</identifier><identifier>EISBN: 1479902322</identifier><identifier>EISBN: 9781479902323</identifier><identifier>DOI: 10.1109/ECTC.2013.6575820</identifier><language>eng</language><publisher>IEEE</publisher><subject>Adhesives ; Cells (biology) ; Microfluidics ; Packaging ; Substrates</subject><ispartof>2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.1800-1805</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6575820$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54555,54920,54932</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6575820$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Babikian, Sarkis</creatorcontrib><creatorcontrib>Cox-Muranami, Wesley A.</creatorcontrib><creatorcontrib>Nelson, Edward</creatorcontrib><creatorcontrib>Li, G. P.</creatorcontrib><creatorcontrib>Bachman, Mark</creatorcontrib><title>Ethylene-Vinyl Acetate as a low cost encapsulant for hybrid electronic and fluidic circuits</title><title>2013 IEEE 63rd Electronic Components and Technology Conference</title><addtitle>ECTC</addtitle><description>We have developed a novel process that uses Ethylene-Vinyl Acetate (EVA) films to realize low cost integrated microfluidic systems in small packages. The EVA acts as both a final package for the device as well as a functional material for hosting molded microfluidic channels and optical structures such as waveguides. In this paper we describe the lamination based packaging of microfluidics, characterize the adhesion strength between layers of the device and investigate the biocompatibility of EVA for microfluidic applications.</description><subject>Adhesives</subject><subject>Cells (biology)</subject><subject>Microfluidics</subject><subject>Packaging</subject><subject>Substrates</subject><issn>0569-5503</issn><issn>2377-5726</issn><isbn>9781479902330</isbn><isbn>1479902330</isbn><isbn>1479902322</isbn><isbn>9781479902323</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2013</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNo1kMlqwzAYhNUNmqR5gNKLXsCpVss6BpMuEOgl7aWHIP2SiIpqB0uh-O1raHqaGT4YhkHonpIVpUQ_btpdu2KE8lUtlWwYuUBzKpTWhHHGLtGMcaUqqVh9hZZaNf-Mk2s0I7LWlZSE36J5zl-ECEJoM0Ofm3IYk-989RG7MeE1-GKKxyZjg1P_g6HPBfsOzDGfkukKDv2AD6MdosM-eShD30XApnM4pFN0k4c4wCmWfIdugknZL8-6QO9Pm137Um3fnl_b9baKVMlSmWmp1VxbSh0HSploACQzVgQrPTAIqnFTdMYwJrkIyjvNA7GgrBBG8gV6-OuN3vv9cYjfZhj355P4L3z_WEQ</recordid><startdate>201305</startdate><enddate>201305</enddate><creator>Babikian, Sarkis</creator><creator>Cox-Muranami, Wesley A.</creator><creator>Nelson, Edward</creator><creator>Li, G. P.</creator><creator>Bachman, Mark</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>201305</creationdate><title>Ethylene-Vinyl Acetate as a low cost encapsulant for hybrid electronic and fluidic circuits</title><author>Babikian, Sarkis ; Cox-Muranami, Wesley A. ; Nelson, Edward ; Li, G. P. ; Bachman, Mark</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-a814b939b11d3c11248cc52ab4fb5ec2cf78d2abdaa22534f7ed93f0bc7b44a53</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Adhesives</topic><topic>Cells (biology)</topic><topic>Microfluidics</topic><topic>Packaging</topic><topic>Substrates</topic><toplevel>online_resources</toplevel><creatorcontrib>Babikian, Sarkis</creatorcontrib><creatorcontrib>Cox-Muranami, Wesley A.</creatorcontrib><creatorcontrib>Nelson, Edward</creatorcontrib><creatorcontrib>Li, G. P.</creatorcontrib><creatorcontrib>Bachman, Mark</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library Online</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Babikian, Sarkis</au><au>Cox-Muranami, Wesley A.</au><au>Nelson, Edward</au><au>Li, G. P.</au><au>Bachman, Mark</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Ethylene-Vinyl Acetate as a low cost encapsulant for hybrid electronic and fluidic circuits</atitle><btitle>2013 IEEE 63rd Electronic Components and Technology Conference</btitle><stitle>ECTC</stitle><date>2013-05</date><risdate>2013</risdate><spage>1800</spage><epage>1805</epage><pages>1800-1805</pages><issn>0569-5503</issn><eissn>2377-5726</eissn><isbn>9781479902330</isbn><isbn>1479902330</isbn><eisbn>1479902322</eisbn><eisbn>9781479902323</eisbn><abstract>We have developed a novel process that uses Ethylene-Vinyl Acetate (EVA) films to realize low cost integrated microfluidic systems in small packages. The EVA acts as both a final package for the device as well as a functional material for hosting molded microfluidic channels and optical structures such as waveguides. In this paper we describe the lamination based packaging of microfluidics, characterize the adhesion strength between layers of the device and investigate the biocompatibility of EVA for microfluidic applications.</abstract><pub>IEEE</pub><doi>10.1109/ECTC.2013.6575820</doi><tpages>6</tpages></addata></record>
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subjects Adhesives
Cells (biology)
Microfluidics
Packaging
Substrates
title Ethylene-Vinyl Acetate as a low cost encapsulant for hybrid electronic and fluidic circuits
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T02%3A53%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Ethylene-Vinyl%20Acetate%20as%20a%20low%20cost%20encapsulant%20for%20hybrid%20electronic%20and%20fluidic%20circuits&rft.btitle=2013%20IEEE%2063rd%20Electronic%20Components%20and%20Technology%20Conference&rft.au=Babikian,%20Sarkis&rft.date=2013-05&rft.spage=1800&rft.epage=1805&rft.pages=1800-1805&rft.issn=0569-5503&rft.eissn=2377-5726&rft.isbn=9781479902330&rft.isbn_list=1479902330&rft_id=info:doi/10.1109/ECTC.2013.6575820&rft.eisbn=1479902322&rft.eisbn_list=9781479902323&rft_dat=%3Cieee_6IE%3E6575820%3C/ieee_6IE%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-i175t-a814b939b11d3c11248cc52ab4fb5ec2cf78d2abdaa22534f7ed93f0bc7b44a53%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=6575820&rfr_iscdi=true