High-performance inductors for integrated fan-out wafer level packaging (InFO-WLP)

Integrated fan-out wafer-level packaging (InFO-WLP) technology with state-of-the-art quality factor (Q) = 64 in 2.4GHz inductor has been demonstrated for RF systems. For the first time, radio frequency (RF) circuits with InFO-WLP have been fabricated to illustrate how the high Q inductor can be used...

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Bibliographic Details
Main Authors: Chen, S. M., Huang, L. H., Yeh, J. H., Lin, Y. J., Kuo, F. W., Chen, H. N., Chiu, M. Y., Liu, C. C., Yeh, John, Yeh, T. J., Hou, S. Y., Hung, J. P., Lin, J. C., Jou, C. P., Jeng, S. P., Yu, Doug
Format: Conference Proceeding
Language:English
Subjects:
Frequency measurement
Inductors
Noise measurement
Phase noise
Q-factor
System-on-chip
Voltage-controlled oscillators
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Summary:Integrated fan-out wafer-level packaging (InFO-WLP) technology with state-of-the-art quality factor (Q) = 64 in 2.4GHz inductor has been demonstrated for RF systems. For the first time, radio frequency (RF) circuits with InFO-WLP have been fabricated to illustrate how the high Q inductor can be used to dramatically improve performance and power consumption concurrently.
ISSN:0743-1562