Grain boundary and surface scattering in interconnect metals

This work addresses the classical size effect in interconnect metals and presents the theoretical background and quantification of the contributions of grain boundary and surface scattering to the observed resistivity increase in Cu. The results of experimental studies of Cu films and lines are revi...

Full description

Saved in:
Bibliographic Details
Main Authors: Coffey, Kevin R., Barmak, Katayun, Tik Sun, Warren, Andrew P., Bo Yao
Format: Conference Proceeding
Language:English
Subjects:
Conductivity
Conductors
Grain boundaries
Grain size
Phonons
Scattering
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This work addresses the classical size effect in interconnect metals and presents the theoretical background and quantification of the contributions of grain boundary and surface scattering to the observed resistivity increase in Cu. The results of experimental studies of Cu films and lines are reviewed. The extent to which the experimental data supports the theoretically expected interactions between surface and grain boundary scattering mechanisms will also be discussed.
ISSN:2380-632X
2380-6338
DOI:10.1109/IITC.2013.6615565