Soft error rates in solder bumped packaging

Many of the heavier elements used in chip packaging undergo radioactive decay and emit energetic alpha particles. Although the rate of emission is extremely low in terms of health concerns, over the operational life of a circuit the probability of a radiation-induced soft error can be substantial. I...

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Main Author: Roberson, M.W.
Format: Conference Proceeding
Language:English
Subjects:
Alpha particles
Circuits
Error analysis
Lead
Packaging
Particle measurements
Production
Quantum mechanics
Radioactive decay
Radioactive materials
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description Many of the heavier elements used in chip packaging undergo radioactive decay and emit energetic alpha particles. Although the rate of emission is extremely low in terms of health concerns, over the operational life of a circuit the probability of a radiation-induced soft error can be substantial. In this paper I review the physical basis of alpha particle emission and present measurements of the alpha particle emission from materials used in MCNC's solder bumping process, including PbSn solder and BCB.
doi_str_mv 10.1109/ISAPM.1998.664444
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identifier ISBN: 0780347951
ispartof Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153), 1998, p.111-116
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Alpha particles
Circuits
Error analysis
Lead
Packaging
Particle measurements
Production
Quantum mechanics
Radioactive decay
Radioactive materials
title Soft error rates in solder bumped packaging
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