In-line automatic defect classification [wafer fabrication]

Manual review of wafers and classification of defects is a slow, tedious process. While identification of defects is important, this step in wafer fabrication can be a bottleneck to throughput. The accuracy of human classification can vary from day to day, and person to person. In-Line Automatic Def...

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Bibliographic Details
Main Authors: Bennett, M.H., Garvin, J.F., Hightower, J.B., Coldren, D., Reddy, M.
Format: Conference Proceeding
Language:English
Subjects:
Cameras
Failure analysis
Focusing
Inspection
Instruments
Manufacturing
Optical imaging
Production
Testing
Throughput
Online Access:Request full text
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Description
Summary:Manual review of wafers and classification of defects is a slow, tedious process. While identification of defects is important, this step in wafer fabrication can be a bottleneck to throughput. The accuracy of human classification can vary from day to day, and person to person. In-Line Automatic Defect Classification (ADC) is an emerging technology aimed at solving this problem.
DOI:10.1109/ISSM.1997.664582