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122 GHz patch antenna designs by using BCB above SiGe BiCMOS wafer process for system-on-chip applications
Two half-wavelength 122 GHz patch antennas were designed and manufactured by using Benzocyclobutene (BCB) as a dielectric layer above the SiGe BiCMOS wafer. It enables the full integration of the millimeter-wave transceiver circuits and the antennas on a single chip to simplify the packaging procedu...
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| creator | Wang, R. Sun, Y. Kaynak, M. Borngraber, J. Goettel, B. Beer, S. Scheytt, J. C. |
| description | Two half-wavelength 122 GHz patch antennas were designed and manufactured by using Benzocyclobutene (BCB) as a dielectric layer above the SiGe BiCMOS wafer. It enables the full integration of the millimeter-wave transceiver circuits and the antennas on a single chip to simplify the packaging procedure at millimeter-wave frequencies, thereby reducing the cost. The two patch antennas are fed by different feeding methods, i.e. microstrip transmission line direct feed and proximity-coupled feed. They exhibit similar performance and offer the flexibility of designing the interconnects (feed lines routing) between the circuits and the antennas within the very limited chip area. The measured gain is 3.4 dBi at 122.5 GHz (the center frequency of the ISM band of 122-123 GHz) for both designs with a simulated efficiency of about 50%. |
| doi_str_mv | 10.1109/PIMRC.2013.6666358 |
| format | conference_proceeding |
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C.</creatorcontrib><title>122 GHz patch antenna designs by using BCB above SiGe BiCMOS wafer process for system-on-chip applications</title><title>2013 IEEE 24th Annual International Symposium on Personal, Indoor, and Mobile Radio Communications (PIMRC)</title><addtitle>PIMRC</addtitle><description>Two half-wavelength 122 GHz patch antennas were designed and manufactured by using Benzocyclobutene (BCB) as a dielectric layer above the SiGe BiCMOS wafer. It enables the full integration of the millimeter-wave transceiver circuits and the antennas on a single chip to simplify the packaging procedure at millimeter-wave frequencies, thereby reducing the cost. The two patch antennas are fed by different feeding methods, i.e. microstrip transmission line direct feed and proximity-coupled feed. They exhibit similar performance and offer the flexibility of designing the interconnects (feed lines routing) between the circuits and the antennas within the very limited chip area. The measured gain is 3.4 dBi at 122.5 GHz (the center frequency of the ISM band of 122-123 GHz) for both designs with a simulated efficiency of about 50%.</description><subject>Antenna measurements</subject><subject>Antennas</subject><subject>BiCMOS integrated circuits</subject><subject>Copper</subject><subject>Gain</subject><subject>millimeter wave integrated circuits</subject><subject>packaging</subject><subject>Patch antennas</subject><subject>System-on-chip</subject><subject>Transmission line measurements</subject><issn>2166-9570</issn><isbn>1467362352</isbn><isbn>9781467362351</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2013</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotkFFPwjAUhWuiiYj8AX25f2DYdlu3PsqiQALBCO_ktr2FEtiWdWrw10si5-F8byf5DmNPgo-F4PrlY778rMaSi3SsLknz8oY9iEwVqZJpLm_ZQAqlEp0X_J6NYjxwzkWhClHyATsIKWE6-4UWe7sHrHuqawRHMezqCOYMXzHUO5hUE0DTfBOsw5RgEqrlag0_6KmDtmssxQi-6SCeY0-npKkTuw8tYNseg8U-NHV8ZHcej5FGVw7Z5v1tU82SxWo6r14XSdC8T5RFLKzWpsguLai0OlOeENE4TS4rHbcZ99I6RxcDr4zxTjlucm-MyVU6ZM__s4GItm0XTtidt9dn0j8mZFk3</recordid><startdate>201309</startdate><enddate>201309</enddate><creator>Wang, R.</creator><creator>Sun, Y.</creator><creator>Kaynak, M.</creator><creator>Borngraber, J.</creator><creator>Goettel, B.</creator><creator>Beer, S.</creator><creator>Scheytt, J. C.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201309</creationdate><title>122 GHz patch antenna designs by using BCB above SiGe BiCMOS wafer process for system-on-chip applications</title><author>Wang, R. ; Sun, Y. ; Kaynak, M. ; Borngraber, J. ; Goettel, B. ; Beer, S. ; Scheytt, J. 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C.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Wang, R.</au><au>Sun, Y.</au><au>Kaynak, M.</au><au>Borngraber, J.</au><au>Goettel, B.</au><au>Beer, S.</au><au>Scheytt, J. C.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>122 GHz patch antenna designs by using BCB above SiGe BiCMOS wafer process for system-on-chip applications</atitle><btitle>2013 IEEE 24th Annual International Symposium on Personal, Indoor, and Mobile Radio Communications (PIMRC)</btitle><stitle>PIMRC</stitle><date>2013-09</date><risdate>2013</risdate><spage>1392</spage><epage>1396</epage><pages>1392-1396</pages><issn>2166-9570</issn><eisbn>1467362352</eisbn><eisbn>9781467362351</eisbn><abstract>Two half-wavelength 122 GHz patch antennas were designed and manufactured by using Benzocyclobutene (BCB) as a dielectric layer above the SiGe BiCMOS wafer. It enables the full integration of the millimeter-wave transceiver circuits and the antennas on a single chip to simplify the packaging procedure at millimeter-wave frequencies, thereby reducing the cost. The two patch antennas are fed by different feeding methods, i.e. microstrip transmission line direct feed and proximity-coupled feed. They exhibit similar performance and offer the flexibility of designing the interconnects (feed lines routing) between the circuits and the antennas within the very limited chip area. The measured gain is 3.4 dBi at 122.5 GHz (the center frequency of the ISM band of 122-123 GHz) for both designs with a simulated efficiency of about 50%.</abstract><pub>IEEE</pub><doi>10.1109/PIMRC.2013.6666358</doi><tpages>5</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 2166-9570 |
| ispartof | 2013 IEEE 24th Annual International Symposium on Personal, Indoor, and Mobile Radio Communications (PIMRC), 2013, p.1392-1396 |
| issn | 2166-9570 |
| language | eng |
| recordid | cdi_ieee_primary_6666358 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Antenna measurements Antennas BiCMOS integrated circuits Copper Gain millimeter wave integrated circuits packaging Patch antennas System-on-chip Transmission line measurements |
| title | 122 GHz patch antenna designs by using BCB above SiGe BiCMOS wafer process for system-on-chip applications |
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