Three-dimensional stacking FPGA architecture using face-to-face integration

In recent years, as VLSI process scales have developed into deep sub-micrometer dimensions, routing delay problems have become critical. For reconfigurable logic devices (RLDs) like field-programmable gate arrays (FPGAs) in particular, routing resources occupy major parts of the available area and h...

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Bibliographic Details
Main Authors: Hamada, Tetsuro, Qian Zhao, Amagasaki, Motoki, Iida, Masahiro, Kuga, Morihiro, Sueyoshi, Toshinori
Format: Conference Proceeding
Language:English
Subjects:
Field programmable gate arrays
Large scale integration
Performance evaluation
Routing
Three-dimensional displays
Tiles
Wires
Online Access:Request full text
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Summary:In recent years, as VLSI process scales have developed into deep sub-micrometer dimensions, routing delay problems have become critical. For reconfigurable logic devices (RLDs) like field-programmable gate arrays (FPGAs) in particular, routing resources occupy major parts of the available area and hinder performance. In order to balance cost and performance, and to explore 3D FPGA architectures with realistic 3D LSI processes, we proposed a novel two-layers 3D FPGA architecture based on 3D connections on logic block input and output pins. Evaluation shows that this novel RLD with two layers of 3D routing architecture uses 48.75% less on-board area and 30.54% less critical path delay than does a conventional 2D 4-lookup table island-style FPGA on average.
ISSN:2324-8432
DOI:10.1109/VLSI-SoC.2013.6673274