An immersive telepresence platform based on distributed architecture

A novel telepresence platform is proposed in this paper to provide immersive video conferencing based on distributed architecture and enhanced QoS/QoE technology. MCU(Multi-point Control Unit)-based telepresence platform has been widely used as a popular architecture due to its easy implementation o...

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Bibliographic Details
Main Authors: Do Young Kim, Mi Suk Lee, Seung Han Choi, Ki-Jong Koo, Inki Hwang, Yeong Jin Kim
Format: Conference Proceeding
Language:English
Subjects:
Computer architecture
Distributed
Echo cancellers
Immersive
Media
Packet loss
Platform
Protocols
software-based
Telepresence
Online Access:Request full text
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Summary:A novel telepresence platform is proposed in this paper to provide immersive video conferencing based on distributed architecture and enhanced QoS/QoE technology. MCU(Multi-point Control Unit)-based telepresence platform has been widely used as a popular architecture due to its easy implementation of multiple video-audio mixing and conference controls from a central point. MCU-based platform usually inputs all participant's media and outputs mixed media for conference participants one by one through network. Proposed platform has a concept of 'main speaker' by decision algorithm during conference and determines a main speaker who sends a high-resolution media to simple nodes. Simple nodes manage routing tables, and they copy the media packets and forward them to conference participants according to the tables. For the immersive service, a robust packet loss recovery algorithm newly developed covers upto 10% bursty loss to prevent interruption of conference often observed in commercial Internet. Proposed platform with distributed media control protocol with enhanced QoS/QoE technology based on distributed architecture has been designed and implemented by software. It shows meaningful reduction of traffic over network with the shorter end-to-end media delay than observed in MCU-based platform under same conditions.
ISSN:2162-1233
DOI:10.1109/ICTC.2013.6675397