Micro thermoelectric coolers for integrated applications [and semiconductor laser packaging]

A different approach for manufacturing arrays of micro thermoelectric coolers using integrated circuit technology is presented. The idea is to fabricate a synthetic wafer containing the necessary thermoelectric elements by first bonding alternating p and n type wafers and then slicing them to obtain...

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Bibliographic Details
Main Authors: Rushing, L., Shakouri, A., Abraham, P., Bowers, J.E.
Format: Conference Proceeding
Language:English
Subjects:
Contact resistance
Cooling
Costs
Current density
Electronics packaging
Integrated circuit technology
Semiconductor device packaging
Semiconductor laser arrays
Thermoelectricity
Wafer bonding
Online Access:Request full text
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Description
Summary:A different approach for manufacturing arrays of micro thermoelectric coolers using integrated circuit technology is presented. The idea is to fabricate a synthetic wafer containing the necessary thermoelectric elements by first bonding alternating p and n type wafers and then slicing them to obtain an array of thermocouples. This array is then metallized using standard photolithography and evaporation techniques to yield an array of coolers. To demonstrate this approach, six element Bi/sub 2/Te/sub 3/ cooler arrays were made and characterized. In this paper scaling laws, processing details, practical limitations, and preliminary experimental results are discussed.
ISSN:1094-2734
DOI:10.1109/ICT.1997.667612