High threshold voltage p-GaN gate power devices on 200 mm Si

In this paper, we present high threshold voltage, low on-resistance, and high speed GaN-HEMT devices using a p-GaN layer in the gate stack. There are three novel features - first, for the first time, p-GaN gate HEMTs were fabricated on a 200-mm GaN on Si substrate using a Au-free fully CMOS-compatib...

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Main Authors: Jongseob Kim, Sun-Kyu Hwang, Injun Hwang, Hyoji Choi, Soogine Chong, Hyun-Sik Choi, Woochul Jeon, Hyuk Soon Choi, Jun Yong Kim, Young Hwan Park, Kyung Yeon Kim, Jong-Bong Park, Jong-Bong Ha, Ki Yeol Park, Jaejoon Oh, Jai Kwang Shin, U-In Chung, In-Kyeong Yoo, Kinam Kim
Format: Conference Proceeding
Language:English
Subjects:
Current measurement
Gallium nitride
HEMTs
Logic gates
MODFETs
Silicon
Switches
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Summary:In this paper, we present high threshold voltage, low on-resistance, and high speed GaN-HEMT devices using a p-GaN layer in the gate stack. There are three novel features - first, for the first time, p-GaN gate HEMTs were fabricated on a 200-mm GaN on Si substrate using a Au-free fully CMOS-compatible process. Second, good electrical characteristics, including a threshold voltage of higher than 2.8 V, a low gate leakage current, no hysteresis, and fast switching, were obtained by employing a p-GaN and W gate stack. Finally, TO-220 packaged p-GaN gate HEMT devices, which can sustain a gate bias of up to 20 V, were demonstrated. Such properties indicate that our p-GaN HEMT devices are compatible with the conventional gate drivers for Si power devices.
ISSN:1063-6854
1946-0201
DOI:10.1109/ISPSD.2013.6694412