A low-cost broadband bondwire interconnect for heterogeneous system integration

A low-cost broadband interconnect, composed of bondwires and transmission lines, is proposed for heterogeneous system integration. By designing the length and the characteristic impedance of the transmission lines, the bond wire effect can be reduced to provide an interconnect with good return loss...

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Bibliographic Details
Main Authors: Chun-Hsing Li, Chun-Lin Ko, Chien-Nan Kuo, Ming-Ching Kuo, Da-Chiang Chang
Format: Conference Proceeding
Language:English
Subjects:
bondwire
Broadband
Broadband communication
heterogeneous integration
Insertion loss
Integrated circuit interconnections
interconnect
Loss measurement
Millimeter wave technology
Power transmission lines
Transmission line measurements
transmission lines
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Summary:A low-cost broadband interconnect, composed of bondwires and transmission lines, is proposed for heterogeneous system integration. By designing the length and the characteristic impedance of the transmission lines, the bond wire effect can be reduced to provide an interconnect with good return loss and low insertion loss. In this work, the chip and the carrier are realized in 90-nm CMOS and GIPD process, respectively. Measured results show that the return loss and the insertion loss are better than 10 dB and 1.1 dB, respectively, from DC to 45.2 GHz.
ISSN:0149-645X
2576-7216
DOI:10.1109/MWSYM.2013.6697395