A new failure mechanism by corrosion of tungsten in a tungsten plug process

The tungsten filled via plug process is commonly used in sub-half micron CMOS process technologies. As process technologies shrink beyond the 0.25 /spl mu/m generation, the metal overlap over the via also reduces. This results in vias which are not fully covered by the overlying interconnect lines....

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Main Authors: Bothra, S., Sur, H., Liang, V.
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Circuit testing
CMOS process
CMOS technology
Corrosion
Electrical resistance measurement
Failure analysis
Plugs
Tungsten
Very large scale integration
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creator Bothra, S.
Sur, H.
Liang, V.
description The tungsten filled via plug process is commonly used in sub-half micron CMOS process technologies. As process technologies shrink beyond the 0.25 /spl mu/m generation, the metal overlap over the via also reduces. This results in vias which are not fully covered by the overlying interconnect lines. In the evaluation of such structures, we have observed a new failure mechanism resulting in completely unfilled vias due to electrochemical corrosion accelerated by a positive charge on specific structures.
doi_str_mv 10.1109/RELPHY.1998.670473
format conference_proceeding
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As process technologies shrink beyond the 0.25 /spl mu/m generation, the metal overlap over the via also reduces. This results in vias which are not fully covered by the overlying interconnect lines. In the evaluation of such structures, we have observed a new failure mechanism resulting in completely unfilled vias due to electrochemical corrosion accelerated by a positive charge on specific structures.</description><identifier>ISBN: 0780344006</identifier><identifier>ISBN: 9780780344006</identifier><identifier>DOI: 10.1109/RELPHY.1998.670473</identifier><language>eng</language><publisher>IEEE</publisher><subject>Bonding ; Circuit testing ; CMOS process ; CMOS technology ; Corrosion ; Electrical resistance measurement ; Failure analysis ; Plugs ; Tungsten ; Very large scale integration</subject><ispartof>1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. 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ispartof 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173), 1998, p.150-156
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Bonding
Circuit testing
CMOS process
CMOS technology
Corrosion
Electrical resistance measurement
Failure analysis
Plugs
Tungsten
Very large scale integration
title A new failure mechanism by corrosion of tungsten in a tungsten plug process
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