Packaging properties of ALIVH-CSP using SBB flip-chip bonding technology

• Main Authors: Itagaki, M., Amami, K., Tomura, Y., Yuhaku, S., Noda, O., Bessho, Y., Eda, K., Ishida, T.
• Format: Conference Proceeding
• Language: English
• Subjects: Bonding; Ceramics; Chip scale packaging; Consumer electronics; Costs; Electronics packaging; Fabrication; Semiconductor device packaging; Substrates; Thermal stresses
• DOI: 10.1109/ICMCM.1998.670786

A new chip scale package (CSP) using an organic laminated substrate (CSP-L) was developed, which was fabricated using an ALIVH (any layer inner via hole) substrate as an interposer and stud-bump-bonding (SBB) flip-chip technology. The ALIVH substrate is a multilayered organic substrate with inner via holes in any layer. The newly developed CSP-L using the ALIVH substrate realized package size miniaturization on the same scale as a CSP using a ceramic substrate (CSP-C). The SBB flip-chip bonding on the ALIVH substrate required an excellent substrate surface coplanarity. The required coplanarity was obtained using a fixture during the SBB flip-chip bonding process. The first-level packaging reliability and the second-level packaging reliability on a glass-epoxy motherboard were evaluated. The resulting reliabilities were good enough for practical applications.