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Ground Bounce Noise Induced by Crosstalk Noise for Two Parallel Ground Planes With a Narrow Open-Stub Line and Adjacent Signal Traces in Multilayer Package Structure
This paper investigates how ground bounce noise (GBN) is generated by crosstalk noises for two parallel ground planes with a narrow open-stub line (NOSL) and adjacent signal traces in a multilayer package structure. A noise reduction scheme and design guidelines for preventing intense noises (GBN an...
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Published in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2014-05, Vol.4 (5), p.870-881 |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | This paper investigates how ground bounce noise (GBN) is generated by crosstalk noises for two parallel ground planes with a narrow open-stub line (NOSL) and adjacent signal traces in a multilayer package structure. A noise reduction scheme and design guidelines for preventing intense noises (GBN and coupled noise) are also proposed. A graphical method that is based on wave tracing is also developed to elucidate the generation of crosstalk noise by adjacent signal traces on an NOSL. The mechanism of generation of the GBN by crosstalk noise can be elucidated based on reflection theory, open-stub quarter-wavelength resonance, and parallel-plane resonance. The time-domain simulation results are analyzed using a 3-D full-wave simulator, Computer Simulation Technology. Using an additional shorting via at the connection between the NOSL and parallel ground planes, the proposed noise reduction scheme can significantly reduce the GBN and coupled noise. Moreover, guidelines for designing the test structure to minimize noise (GBN and coupled noise) are presented. Finally, the simulation and measurement results in the time domain are compared to validate the proposed analysis and noise reduction scheme. |
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ISSN: | 2156-3950 2156-3985 |
DOI: | 10.1109/TCPMT.2014.2299281 |