Education project for the development of curricula, research and prototyping facilities in the field of electronics interconnection and packaging

The preparation of electronics engineers for the 21st century's requirements in the field of microelectronics interconnection and packaging is a real challenge for today's education. An approach that provides appropriate lecture courses and practical experiments, initiates students into re...

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Bibliographic Details
Main Authors: Illyefalvi-Vitez, Z., Harsanyi, G., Nemeth, P., Pinkola, J.
Format: Conference Proceeding
Language:English
Subjects:
Computer aided manufacturing
Computer integrated manufacturing
Electronics industry
Electronics packaging
Integrated circuit interconnections
Integrated circuit technology
Materials science and technology
Microelectronics
Prototypes
Thin film sensors
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Description
Summary:The preparation of electronics engineers for the 21st century's requirements in the field of microelectronics interconnection and packaging is a real challenge for today's education. An approach that provides appropriate lecture courses and practical experiments, initiates students into research projects, and teaches technology in a real prototype manufacturing environment, can hopefully achieve the main goals. A project for the development of the education has been started.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.1998.678767