Integrating 3D PIN germanium detectors with high-k ALD fabricated slot waveguides

A novel device technology for photonics integrated circuits (PICs) is presented. In this work germanium PIN photodetectors are embedded in back-end deposited high-k slot waveguides. The waveguides are fabricated using chemical vapor deposited amorphous silicon and atomic layer deposition of Al 2 O 3...

Full description

Saved in:
Bibliographic Details
Main Authors: Naiini, Maziar M., Radamson, Henry H., Malm, Gunnar, Ostling, Mikael
Format: Conference Proceeding
Language:English
Subjects:
CMOS technology
Couplers
Detectors
Germanium
germanium photodetectors
optical interconnects
Optical waveguides
Photodetectors
Photonics
photonics integrated circuits(PIC)
Silicon
silicon photonics
slot waveguides
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:A novel device technology for photonics integrated circuits (PICs) is presented. In this work germanium PIN photodetectors are embedded in back-end deposited high-k slot waveguides. The waveguides are fabricated using chemical vapor deposited amorphous silicon and atomic layer deposition of Al 2 O 3 thin films. The germanium PIN stack is selectively grown on a bulk silicon substrate. The detectors are butt coupled to the slot waveguides. Using our selective germanium growth and interconnect technology we study a 3D multilayer photonic integration for CMOS back-end of the line (BEOL) process. Finally we demonstrate the fabrication of a photonic chip deploying this technology platform.
DOI:10.1109/ULIS.2014.6813902