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Integrating 3D PIN germanium detectors with high-k ALD fabricated slot waveguides
A novel device technology for photonics integrated circuits (PICs) is presented. In this work germanium PIN photodetectors are embedded in back-end deposited high-k slot waveguides. The waveguides are fabricated using chemical vapor deposited amorphous silicon and atomic layer deposition of Al 2 O 3...
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| creator | Naiini, Maziar M. Radamson, Henry H. Malm, Gunnar Ostling, Mikael |
| description | A novel device technology for photonics integrated circuits (PICs) is presented. In this work germanium PIN photodetectors are embedded in back-end deposited high-k slot waveguides. The waveguides are fabricated using chemical vapor deposited amorphous silicon and atomic layer deposition of Al 2 O 3 thin films. The germanium PIN stack is selectively grown on a bulk silicon substrate. The detectors are butt coupled to the slot waveguides. Using our selective germanium growth and interconnect technology we study a 3D multilayer photonic integration for CMOS back-end of the line (BEOL) process. Finally we demonstrate the fabrication of a photonic chip deploying this technology platform. |
| doi_str_mv | 10.1109/ULIS.2014.6813902 |
| format | conference_proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_6813902</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6813902</ieee_id><sourcerecordid>6813902</sourcerecordid><originalsourceid>FETCH-LOGICAL-i246t-e4c32fbe40a9bd1d033e7a74934f80032533419c7deebe4248d84ed7a882663e3</originalsourceid><addsrcrecordid>eNotj0tOwzAUAM0CCSg9AGLjCyQ8-7mJvaxaoJEiPoKuKyd-SQxNi2yXituDRFezGY00jN0IyIUAc7euq7dcglB5oQUakGfsSqjSGCyFnl2waYwfACBMoUGbS_Za7RL1wSa_6zku-Uv1xHsKo935w8gdJWrTPkR-9Gngg--H7JPP6yXvbBN8axM5Hrf7xI_2m_qDdxSv2Xlnt5GmJ07Y-uH-fbHK6ufHajGvMy9VkTJSLcquIQXWNE44QKTSlsqg6jQAyhmiEqYtHdGfJZV2WpErrdayKJBwwm7_u56INl_Bjzb8bE7X-As6D00G</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Integrating 3D PIN germanium detectors with high-k ALD fabricated slot waveguides</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Naiini, Maziar M. ; Radamson, Henry H. ; Malm, Gunnar ; Ostling, Mikael</creator><creatorcontrib>Naiini, Maziar M. ; Radamson, Henry H. ; Malm, Gunnar ; Ostling, Mikael</creatorcontrib><description>A novel device technology for photonics integrated circuits (PICs) is presented. In this work germanium PIN photodetectors are embedded in back-end deposited high-k slot waveguides. The waveguides are fabricated using chemical vapor deposited amorphous silicon and atomic layer deposition of Al 2 O 3 thin films. The germanium PIN stack is selectively grown on a bulk silicon substrate. The detectors are butt coupled to the slot waveguides. Using our selective germanium growth and interconnect technology we study a 3D multilayer photonic integration for CMOS back-end of the line (BEOL) process. Finally we demonstrate the fabrication of a photonic chip deploying this technology platform.</description><identifier>EISBN: 1479937185</identifier><identifier>EISBN: 9781479937189</identifier><identifier>DOI: 10.1109/ULIS.2014.6813902</identifier><language>eng</language><publisher>IEEE</publisher><subject>CMOS technology ; Couplers ; Detectors ; Germanium ; germanium photodetectors ; optical interconnects ; Optical waveguides ; Photodetectors ; Photonics ; photonics integrated circuits(PIC) ; Silicon ; silicon photonics ; slot waveguides</subject><ispartof>2014 15th International Conference on Ultimate Integration on Silicon (ULIS), 2014, p.45-48</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6813902$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6813902$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Naiini, Maziar M.</creatorcontrib><creatorcontrib>Radamson, Henry H.</creatorcontrib><creatorcontrib>Malm, Gunnar</creatorcontrib><creatorcontrib>Ostling, Mikael</creatorcontrib><title>Integrating 3D PIN germanium detectors with high-k ALD fabricated slot waveguides</title><title>2014 15th International Conference on Ultimate Integration on Silicon (ULIS)</title><addtitle>ULIS</addtitle><description>A novel device technology for photonics integrated circuits (PICs) is presented. In this work germanium PIN photodetectors are embedded in back-end deposited high-k slot waveguides. The waveguides are fabricated using chemical vapor deposited amorphous silicon and atomic layer deposition of Al 2 O 3 thin films. The germanium PIN stack is selectively grown on a bulk silicon substrate. The detectors are butt coupled to the slot waveguides. Using our selective germanium growth and interconnect technology we study a 3D multilayer photonic integration for CMOS back-end of the line (BEOL) process. Finally we demonstrate the fabrication of a photonic chip deploying this technology platform.</description><subject>CMOS technology</subject><subject>Couplers</subject><subject>Detectors</subject><subject>Germanium</subject><subject>germanium photodetectors</subject><subject>optical interconnects</subject><subject>Optical waveguides</subject><subject>Photodetectors</subject><subject>Photonics</subject><subject>photonics integrated circuits(PIC)</subject><subject>Silicon</subject><subject>silicon photonics</subject><subject>slot waveguides</subject><isbn>1479937185</isbn><isbn>9781479937189</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2014</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotj0tOwzAUAM0CCSg9AGLjCyQ8-7mJvaxaoJEiPoKuKyd-SQxNi2yXituDRFezGY00jN0IyIUAc7euq7dcglB5oQUakGfsSqjSGCyFnl2waYwfACBMoUGbS_Za7RL1wSa_6zku-Uv1xHsKo935w8gdJWrTPkR-9Gngg--H7JPP6yXvbBN8axM5Hrf7xI_2m_qDdxSv2Xlnt5GmJ07Y-uH-fbHK6ufHajGvMy9VkTJSLcquIQXWNE44QKTSlsqg6jQAyhmiEqYtHdGfJZV2WpErrdayKJBwwm7_u56INl_Bjzb8bE7X-As6D00G</recordid><startdate>20140101</startdate><enddate>20140101</enddate><creator>Naiini, Maziar M.</creator><creator>Radamson, Henry H.</creator><creator>Malm, Gunnar</creator><creator>Ostling, Mikael</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>20140101</creationdate><title>Integrating 3D PIN germanium detectors with high-k ALD fabricated slot waveguides</title><author>Naiini, Maziar M. ; Radamson, Henry H. ; Malm, Gunnar ; Ostling, Mikael</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i246t-e4c32fbe40a9bd1d033e7a74934f80032533419c7deebe4248d84ed7a882663e3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2014</creationdate><topic>CMOS technology</topic><topic>Couplers</topic><topic>Detectors</topic><topic>Germanium</topic><topic>germanium photodetectors</topic><topic>optical interconnects</topic><topic>Optical waveguides</topic><topic>Photodetectors</topic><topic>Photonics</topic><topic>photonics integrated circuits(PIC)</topic><topic>Silicon</topic><topic>silicon photonics</topic><topic>slot waveguides</topic><toplevel>online_resources</toplevel><creatorcontrib>Naiini, Maziar M.</creatorcontrib><creatorcontrib>Radamson, Henry H.</creatorcontrib><creatorcontrib>Malm, Gunnar</creatorcontrib><creatorcontrib>Ostling, Mikael</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Naiini, Maziar M.</au><au>Radamson, Henry H.</au><au>Malm, Gunnar</au><au>Ostling, Mikael</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Integrating 3D PIN germanium detectors with high-k ALD fabricated slot waveguides</atitle><btitle>2014 15th International Conference on Ultimate Integration on Silicon (ULIS)</btitle><stitle>ULIS</stitle><date>2014-01-01</date><risdate>2014</risdate><spage>45</spage><epage>48</epage><pages>45-48</pages><eisbn>1479937185</eisbn><eisbn>9781479937189</eisbn><abstract>A novel device technology for photonics integrated circuits (PICs) is presented. In this work germanium PIN photodetectors are embedded in back-end deposited high-k slot waveguides. The waveguides are fabricated using chemical vapor deposited amorphous silicon and atomic layer deposition of Al 2 O 3 thin films. The germanium PIN stack is selectively grown on a bulk silicon substrate. The detectors are butt coupled to the slot waveguides. Using our selective germanium growth and interconnect technology we study a 3D multilayer photonic integration for CMOS back-end of the line (BEOL) process. Finally we demonstrate the fabrication of a photonic chip deploying this technology platform.</abstract><pub>IEEE</pub><doi>10.1109/ULIS.2014.6813902</doi><tpages>4</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | EISBN: 1479937185 |
| ispartof | 2014 15th International Conference on Ultimate Integration on Silicon (ULIS), 2014, p.45-48 |
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| language | eng |
| recordid | cdi_ieee_primary_6813902 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | CMOS technology Couplers Detectors Germanium germanium photodetectors optical interconnects Optical waveguides Photodetectors Photonics photonics integrated circuits(PIC) Silicon silicon photonics slot waveguides |
| title | Integrating 3D PIN germanium detectors with high-k ALD fabricated slot waveguides |
| url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-01T01%3A42%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Integrating%203D%20PIN%20germanium%20detectors%20with%20high-k%20ALD%20fabricated%20slot%20waveguides&rft.btitle=2014%2015th%20International%20Conference%20on%20Ultimate%20Integration%20on%20Silicon%20(ULIS)&rft.au=Naiini,%20Maziar%20M.&rft.date=2014-01-01&rft.spage=45&rft.epage=48&rft.pages=45-48&rft_id=info:doi/10.1109/ULIS.2014.6813902&rft.eisbn=1479937185&rft.eisbn_list=9781479937189&rft_dat=%3Cieee_6IE%3E6813902%3C/ieee_6IE%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-i246t-e4c32fbe40a9bd1d033e7a74934f80032533419c7deebe4248d84ed7a882663e3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=6813902&rfr_iscdi=true |