Physically flexible high performance single crystal CMOS integrated with printed electronics

Flexible electronic systems have been limited by the ability to integrate IC functionality. Traditional silicon-based ICs are not flexible, and flexible transistors are too large and too slow to approach silicon-based IC density and performance. Transferring standard silicon IC wafers to polymer sub...

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Bibliographic Details
Main Authors: Chaney, Richard L., Hackler, Douglas R., Wilson, Dale G., Meek, Brian N.
Format: Conference Proceeding
Language:English
Subjects:
CMOS
CMOS integrated circuits
Consumer electronics
Density
Electronic systems
Electronics
FHS
FleX
flexible
Flexible printed circuits
Hybrid systems
Integrated circuits
Military aircraft
Silicon
Silicon substrates
Transistors
Workshops
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Description
Summary:Flexible electronic systems have been limited by the ability to integrate IC functionality. Traditional silicon-based ICs are not flexible, and flexible transistors are too large and too slow to approach silicon-based IC density and performance. Transferring standard silicon IC wafers to polymer substrates addresses these limitations by transforming traditional ICs into a physically flexible form factor. Integrating these flexible ICs with printed electronics creates Flexible Hybrid Systems and enables a new generation of electronics.
ISSN:1947-3834
1947-3842
DOI:10.1109/WMED.2014.6818725