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Low-Profile Substrate Integrated Dielectric Resonator Antenna Implemented With PCB Process
A kind of low-profile substrate integrated dielectric resonator antenna (SIDRA) is proposed and experimentally verified at millimeter-wave (mmW) bands. The antenna is implemented with a two-layer printed circuit board (PCB) process, in which the integrated dielectric resonate radiator is fabricated...
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Published in: | IEEE antennas and wireless propagation letters 2014, Vol.13, p.1023-1026 |
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Main Authors: | , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | A kind of low-profile substrate integrated dielectric resonator antenna (SIDRA) is proposed and experimentally verified at millimeter-wave (mmW) bands. The antenna is implemented with a two-layer printed circuit board (PCB) process, in which the integrated dielectric resonate radiator is fabricated in the top layer with moderate permittivity, which is fed by substrate integrated waveguide (SIW) implemented in the bottom layer with low permittivity through a coupling slot. The evolution of the SIDRA is illustrated based on the investigation of the effective permittivity of the perforated substrate. The design schemes, procedures, and simulation models are discussed in detail. Good agreement between the measurements and simulations verifies the effectiveness and feasibility of the design methodology. The proposed SIDRA shows the advantages of low profile, low cost, easy manufacture for specific-shaped DRA, high radiation efficiency, and convenient integration with other planar circuits. |
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ISSN: | 1536-1225 1548-5757 |
DOI: | 10.1109/LAWP.2014.2325033 |