Study of a single layer ultrathin CoMo film as a direct plateable adhesion/barrier layer for next generation interconnect

In this work, a novel single layer CoMo alloy film is investigated as an excellent adhesion/diffusion barrier to copper metallization. The ultrathin (

Saved in:
Bibliographic Details
Main Authors: Xin-Ping Qu, Xu Wang, Li-Ao Cao, Wen-Zhong Xu
Format: Conference Proceeding
Language:English
Subjects:
Abstracts
Adhesives
Annealing
Copper
FCC
Silicon
Citations: Items that cite this one
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:In this work, a novel single layer CoMo alloy film is investigated as an excellent adhesion/diffusion barrier to copper metallization. The ultrathin (
ISSN:2380-632X
2380-6338
DOI:10.1109/IITC.2014.6831889