Development of a Gas-Fed Plasma Source for Pulsed High-Density Plasma/Material Interaction Studies

A gas-fed capillary plasma source has been developed to study plasma-surface interactions under pulsed high pressure arc conditions, without the use of an exploding fuse wire or ablative liner. A nonintrusive preionization source has been developed to break down relatively large interelectrode gaps...

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Bibliographic Details
Published in:IEEE transactions on plasma science 2014-10, Vol.42 (10), p.3245-3252
Main Authors: Pachuilo, Michael V., Stefani, Francis, Raja, Laxminarayan L., Bengtson, Roger D., Henkelman, Graeme A., Tas, A. Cuneyt, Kriven, Waltraud M., Suraj, Kumar Sinha
Format: Article
Language:English
Subjects:
Ablation
Arc discharge
Argon
atmospheric discharge
Capacitors
capillary discharge
Channels
Charge
Density
Discharges (electric)
Electric potential
Electrodes
Electron tubes
Fuses
Gases
Plasma physics
plasma-material interaction
Plasmas
Preionization
pulsed thermal plasma
Scanning electron microscopy
Spectrum analysis
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Summary:A gas-fed capillary plasma source has been developed to study plasma-surface interactions under pulsed high pressure arc conditions, without the use of an exploding fuse wire or ablative liner. A nonintrusive preionization source has been developed to break down relatively large interelectrode gaps at low charge voltages of 2-6 kV. The preionization source comprises a nonequilibrium surface streamer discharge that forms a conducting channel through which the main thermal arc discharge is initiated. The arc electron temperature and number density are estimated to be T e ~ 1-2 eV and n e ~ 10 23 m -3 . Silicon and sapphire samples were exposed to the arc plasma and revealed deposition of electrode and wall materials. Substitution of Elkonite 50W3 for brass electrodes reduced plasma contamination to acceptable levels. The plasma-material interactions were examined and quantified using scanning electron microscopy and energy dispersive X-ray spectroscopy.
ISSN:0093-3813
1939-9375
DOI:10.1109/TPS.2014.2344974