Contactless stacked-die testing for pre-bond interposers

A stacked-die product integrates multiple dies on interposers. In this paper, we first discuss the difficulties of traditional testing mechanism for interposers. To improve production yield, a contactless testing mechanism for pre-bond interposers is proposed. Our testing mechanism attempts to detec...

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Bibliographic Details
Main Authors: Jui-Hung Chien, Ruei-Siang Hsu, Hsueh-Ju Lin, Ka-Yi Yeh, Shih-Chieh Chang
Format: Conference Proceeding
Language:English
Subjects:
3D-IC
Classification algorithms
Clustering algorithms
Feature extraction
Heating
Image segmentation
Interposer
Testing
Thermal Analysis
Online Access:Request full text
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Summary:A stacked-die product integrates multiple dies on interposers. In this paper, we first discuss the difficulties of traditional testing mechanism for interposers. To improve production yield, a contactless testing mechanism for pre-bond interposers is proposed. Our testing mechanism attempts to detect a defective interposer from the thermal image after heating the interposer. We propose to extract special features from the thermal image and then use a clustering algorithm to determine whether the interposer is defective. Experimental results show that our testing mechanism can efficiently improve the yield from 70.5% to 96.84%.
ISSN:0738-100X
DOI:10.1109/DAC.2014.6881335