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Contactless stacked-die testing for pre-bond interposers
A stacked-die product integrates multiple dies on interposers. In this paper, we first discuss the difficulties of traditional testing mechanism for interposers. To improve production yield, a contactless testing mechanism for pre-bond interposers is proposed. Our testing mechanism attempts to detec...
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| creator | Jui-Hung Chien Ruei-Siang Hsu Hsueh-Ju Lin Ka-Yi Yeh Shih-Chieh Chang |
| description | A stacked-die product integrates multiple dies on interposers. In this paper, we first discuss the difficulties of traditional testing mechanism for interposers. To improve production yield, a contactless testing mechanism for pre-bond interposers is proposed. Our testing mechanism attempts to detect a defective interposer from the thermal image after heating the interposer. We propose to extract special features from the thermal image and then use a clustering algorithm to determine whether the interposer is defective. Experimental results show that our testing mechanism can efficiently improve the yield from 70.5% to 96.84%. |
| doi_str_mv | 10.1109/DAC.2014.6881335 |
| format | conference_proceeding |
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In this paper, we first discuss the difficulties of traditional testing mechanism for interposers. To improve production yield, a contactless testing mechanism for pre-bond interposers is proposed. Our testing mechanism attempts to detect a defective interposer from the thermal image after heating the interposer. We propose to extract special features from the thermal image and then use a clustering algorithm to determine whether the interposer is defective. Experimental results show that our testing mechanism can efficiently improve the yield from 70.5% to 96.84%.</abstract><pub>IEEE</pub><doi>10.1109/DAC.2014.6881335</doi></addata></record> |
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| identifier | ISSN: 0738-100X |
| ispartof | 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC), 2014, p.1-6 |
| issn | 0738-100X |
| language | eng |
| recordid | cdi_ieee_primary_6881335 |
| source | IEEE Xplore All Conference Series |
| subjects | 3D-IC Classification algorithms Clustering algorithms Feature extraction Heating Image segmentation Interposer Testing Thermal Analysis |
| title | Contactless stacked-die testing for pre-bond interposers |
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