Self-patterning, pre-applied underfilling technology for stack-die packaging

Die stacking is one of the next-generation 3D IC packaging methods, but its stringent material requirements are unlikely to be met by traditional underfills. Moreover, filler trapping is becoming an increasingly serious issue in no-flow and wafer-level underfills. In this report, we demonstrate a no...

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Bibliographic Details
Main Authors: Chia-Chi Tuan, Ziyin Lin, Yan Liu, Kyoung-Sik Moon, Ching-Ping Wong
Format: Conference Proceeding
Language:English
Subjects:
Rough surfaces
Substrates
Surface morphology
Surface roughness
Surface treatment
Vehicles
Online Access:Request full text
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Description
Summary:Die stacking is one of the next-generation 3D IC packaging methods, but its stringent material requirements are unlikely to be met by traditional underfills. Moreover, filler trapping is becoming an increasingly serious issue in no-flow and wafer-level underfills. In this report, we demonstrate a novel underfilling technology for the reduction of filler trapping in fine-pitch interconnects. In our method, we fabricate superhydrophobic bond pads, and control the flow of the underfill material by the surface energy difference between the bond pads and the Si 3 N 4 substrate. The superhydrophobic bond pads are shown to have no effect on the bonding of soldering materials to the pads.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2014.6897613