Non-Contact Probes for On-Wafer Characterization of Sub-Millimeter-Wave Devices and Integrated Circuits

We present a novel non-contact metrology approach for on-wafer characterization of sub-millimeter-wave devices, components, and integrated circuits. Unlike existing contact probes that rely on small metallic tips that make physical contact with the device on the chip, the new non-contact probes are...

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Bibliographic Details
Published in:IEEE transactions on microwave theory and techniques 2014-11, Vol.62 (11), p.2791-2801
Main Authors: Caglayan, Cosan, Trichopoulos, Georgios C., Sertel, Kubilay
Format: Article
Language:English
Subjects:
Antenna measurements
Broadband antennas
Calibration
Coplanar waveguides
Lenses
Measurement techniques
millimeter-wave (mmW) measurements
mmW technology
Probes
sub-mmW measurements
sub-mmW propagation
sub-mmW technology
System-on-chip
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Summary:We present a novel non-contact metrology approach for on-wafer characterization of sub-millimeter-wave devices, components, and integrated circuits. Unlike existing contact probes that rely on small metallic tips that make physical contact with the device on the chip, the new non-contact probes are based on electromagnetic coupling of vector network analyzer (VNA) test ports into the coplanar waveguide environment of integrated devices and circuits. Efficient signal coupling is achieved via a quasi-optical link between the VNA ports and planar antennas that are monolithically integrated with the test device. Experimental validation of the non-contact device metrology system is presented for the first time to demonstrate the accuracy and repeatability of proposed approach for the 325-500-GHz (WR2.2) and 500-750-GHz (WR1.5) bands.
ISSN:0018-9480
1557-9670
DOI:10.1109/TMTT.2014.2356176