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1 Gb/s single beam smart-pixel receiver/transmitter realized in hybrid MQW-CMOS OE-VLSI technology

We present the first operation of an OE/VLSI compatible single-beam receiver-transmitter pair operating to 1 Gb/s. The circuits were realized in 0.35 micron CMOS and hybridized via a flip-chip bonding technique to an array of 850 nm MQW modulator/detectors.

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Bibliographic Details
Main Authors: Woodward, T.K., Krishnamoorthy, A.V., Goossen, K.W., Walker, J.A., Tseng, B.T., Cunningham, J.E., Leibenguth, E., Jan, W.Y.
Format: Conference Proceeding
Language:English
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Description
Summary:We present the first operation of an OE/VLSI compatible single-beam receiver-transmitter pair operating to 1 Gb/s. The circuits were realized in 0.35 micron CMOS and hybridized via a flip-chip bonding technique to an array of 850 nm MQW modulator/detectors.
DOI:10.1109/LEOSST.1998.690400