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1 Gb/s single beam smart-pixel receiver/transmitter realized in hybrid MQW-CMOS OE-VLSI technology
We present the first operation of an OE/VLSI compatible single-beam receiver-transmitter pair operating to 1 Gb/s. The circuits were realized in 0.35 micron CMOS and hybridized via a flip-chip bonding technique to an array of 850 nm MQW modulator/detectors.
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Main Authors: | , , , , , , , |
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Format: | Conference Proceeding |
Language: | English |
Subjects: | |
Online Access: | Request full text |
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Summary: | We present the first operation of an OE/VLSI compatible single-beam receiver-transmitter pair operating to 1 Gb/s. The circuits were realized in 0.35 micron CMOS and hybridized via a flip-chip bonding technique to an array of 850 nm MQW modulator/detectors. |
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DOI: | 10.1109/LEOSST.1998.690400 |