Reliability analysis of electronic assemblies using electrically conductive adhesive for high-reliability and Harsh environment applications

An alternative to lead-free soldering may be Electrically Conductive Adhesives (ECA) that feature lower soldering temperature. However, long-term electrical properties stability and reliability in harsh environment shall be studied. The work presented here is a comprehensive study of ECA second leve...

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Bibliographic Details
Main Authors: Lecavelier des Etangs-Levallois, Aurelien, Grivon, A., Baudet, D., Maia, W. C., Brizoux, M.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Electrical resistance measurement
Electronics packaging
Joints
Reliability
Thermal resistance
Online Access:Request full text
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Summary:An alternative to lead-free soldering may be Electrically Conductive Adhesives (ECA) that feature lower soldering temperature. However, long-term electrical properties stability and reliability in harsh environment shall be studied. The work presented here is a comprehensive study of ECA second level interconnects characterization under thermal and thermo-mechanical stress for different PCB and component finishing.
DOI:10.1109/ESTC.2014.6962846