High-Speed (400 Gb/s) Eight-Channel EADFB Laser Array Module Using Flip-Chip Interconnection Technique

We fabricated a 400-G flip-chip interconnection eight-channel EADFB laser array module. The flip-chip interconnection technique provides a higher modulation bandwidth and lower electrical crosstalk than the wire interconnection technique. The 3-dB bandwidth of the flip-chip interconnection subassemb...

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Bibliographic Details
Published in:IEEE journal of selected topics in quantum electronics 2015-11, Vol.21 (6), p.183-188
Main Authors: Kanazawa, Shigeru, Fujisawa, Takeshi, Ishii, Hiroyuki, Takahata, Kiyoto, Ueda, Yuta, Iga, Ryuzo, Sanjoh, Hiroaki
Format: Article
Language:English
Subjects:
400 Gigabit Ethernet
Arrays
Crosstalk
Distributed feedback laser
EADFB laser array
Electro-absorption modulator
Flip-chip devices
InGaAlAs
Integrated circuit interconnections
Lasers
Modulation
Photonic integrated circuits
Wires
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Summary:We fabricated a 400-G flip-chip interconnection eight-channel EADFB laser array module. The flip-chip interconnection technique provides a higher modulation bandwidth and lower electrical crosstalk than the wire interconnection technique. The 3-dB bandwidth of the flip-chip interconnection subassembly was about 50 GHz. And the electrical crosstalk of the flip-chip interconnection module was suppressed to less than -20 dB below 35 GHz. We obtained clear eye openings for all eight lanes under eight-channel 50-Gb/s simultaneous operation after a 10-km SMF transmission.
ISSN:1077-260X
1558-4542
DOI:10.1109/JSTQE.2015.2415197