DBC switch module for management of temperature and noise in 220-W/in3 power assembly

A switch module integrates semiconductor dies on a direct-bond-copper (DBC) substrate to achieve both noise robustness and low thermal resistance. It outperforms the module integrated on printed circuit board (PCB) to meet high-power-density and high-output-power specifications. The DBC substrate at...

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Bibliographic Details
Main Authors: Jongwon Shin, Woochan Kim, Ngo, Khai D. T.
Format: Conference Proceeding
Language:English
Subjects:
Conductors
high power density
Layout
Logic gates
low thermal resistance
Noise
self-turn-on
SiC/GaN packaging
Substrates
Switch module
Switches
Thermal conductivity
wide band gap (WBG) semiconductor
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Description
Summary:A switch module integrates semiconductor dies on a direct-bond-copper (DBC) substrate to achieve both noise robustness and low thermal resistance. It outperforms the module integrated on printed circuit board (PCB) to meet high-power-density and high-output-power specifications. The DBC substrate attached to an air-cooled heat sink provides 2.35-°C/W thermal resistance to limit the temperature rise of semiconductors switches to 50°C. Compact layout with 2.89-nH common-source inductance and negative coupling between drain and source conductors eliminate self-turn-on from 420-A/μs di/dt. A 2-kW dc-dc boost converter which switched between 400 kHz to 1 MHz achieved a power density of 220 W/in 3 and an efficiency of 98.4% by employing the switch module.
ISSN:1048-2334
2470-6647
DOI:10.1109/APEC.2015.7104498