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3D microelectronic with BEOL compatible devices

This presentation will address the potential of nanoelectronic devices 3D monolithic integration in the CMOS back-end-of-line (BEOL) to add functionality and enhance integrated circuits (ICs) performances.

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Bibliographic Details
Main Authors: Drouin, D., A-Bounouar, M., Droulers, G., Labalette, M., Pioro-Ladriere, M., Souifi, A., Ecoffey, S.
Format: Conference Proceeding
Language:English
Subjects:
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Description
Summary:This presentation will address the potential of nanoelectronic devices 3D monolithic integration in the CMOS back-end-of-line (BEOL) to add functionality and enhance integrated circuits (ICs) performances.
ISSN:1093-0167
2375-1053
DOI:10.1109/VTS.2015.7116262