Laser flip-chip mounting for passive alignment and high-frequency modulation

We have developed a silicon motherboard for flip-chip mounting of lasers in a way that is compatible with high-frequency modulation (24 GHz) and which allows passive alignment of the lasers to single-mode fibres.

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Bibliographic Details
Main Authors: Lindgren, S., Ahlfeldt, H., Backlin, L., Forssen, L., Vieider, C., Elderstig, H., Svensson, M., Granlund, L., Kerzar, B., Broberg, B., Kjebon, O., Schatz, R., Forzelius, E., Nilsson, S.
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Fiber lasers
Frequency modulation
Laboratories
Optical fiber communication
Optical modulation
Semiconductor lasers
Silicon
Surface emitting lasers
Wires
Online Access:Request full text
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Description
Summary:We have developed a silicon motherboard for flip-chip mounting of lasers in a way that is compatible with high-frequency modulation (24 GHz) and which allows passive alignment of the lasers to single-mode fibres.