Fan-out technologies for WiFi SiP module packaging and electrical performance simulation

The purpose of this paper is to study the Wi-Fi SiP (System-in-Package) module manufactured by the Fan-out technology, which includes dual layer RDL. In this Fan-out package, numerous components (including active chip and RLC passive components) are encapsulated by compression molding, and signals a...

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Bibliographic Details
Main Authors: Hsieh, Chueh An, Tsai, Chung Hsuan, Lee, Huan Wun, Lee, Tony Yc, Chang, Harrison
Format: Conference Proceeding
Language:English
Subjects:
Couplings
Electrodes
IEEE 802.11 Standards
Impedance
Impedance matching
Radio frequency
System-on-chip
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Summary:The purpose of this paper is to study the Wi-Fi SiP (System-in-Package) module manufactured by the Fan-out technology, which includes dual layer RDL. In this Fan-out package, numerous components (including active chip and RLC passive components) are encapsulated by compression molding, and signals are interconnected by RDL. Without substrate (replaced by molding compound), this Fan-out package can be thinner and lower cost. Electrical simulation for RF signal integrity is also studied in this paper, to understand the Fan-out technology's characterization on RF SiP design application. To evaluate the Fan-out technology on module level performance, simulation on RF impedance matching, power integrity and thermal distribution with complete Wi-Fi SiP module is also discussed in this paper.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2015.7159820