Loading…
Effects of time-variant non-linear TSV parameters on transient analysis for signal integrity
This paper looksat the impact of considering the exact or approximated values for the nonlinear depletion capacitance in a TSV equivalent circuit for transient analysis. Furthermore, the effects of the time variant and nonlinear behavior of the doped bulk silicon substrate on signal propagation and...
Saved in:
Main Authors: | , , , , |
---|---|
Format: | Conference Proceeding |
Language: | English |
Subjects: | |
Online Access: | Request full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
cited_by | |
---|---|
cites | |
container_end_page | 383 |
container_issue | |
container_start_page | 380 |
container_title | |
container_volume | |
creator | Piersanti, S. de Paulis, F. Orlandi, A. Achkir, B. Fan, J. |
description | This paper looksat the impact of considering the exact or approximated values for the nonlinear depletion capacitance in a TSV equivalent circuit for transient analysis. Furthermore, the effects of the time variant and nonlinear behavior of the doped bulk silicon substrate on signal propagation and crosstalk are also studied. |
doi_str_mv | 10.1109/APEMC.2015.7175241 |
format | conference_proceeding |
fullrecord | <record><control><sourceid>ieee_CHZPO</sourceid><recordid>TN_cdi_ieee_primary_7175241</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>7175241</ieee_id><sourcerecordid>7175241</sourcerecordid><originalsourceid>FETCH-LOGICAL-i208t-c00fff732eb870c2f920c1084f0361f8701fee4c841ccb90ef2c48d619da0e233</originalsourceid><addsrcrecordid>eNotkEtrQjEUhNMX1Fr_QLvJH7j2nNyYx1LEPsDSQm1XBYnxRFI0V5JQ8N_3Ql0NM98wi2HsDmGMCPZh-j5_nY0F4GSsUU-ExDM2stqg1NYqpUGfs4FQEhotlb1gNyegDF72AJVotNLtNRuV8gMAAgBRmQH7nodAvhbeBV7jnppfl6NLlacuNbuYyGW-_PjiB5fdnirlvpl4zS6VSH3NJbc7llh46DIvcdtbHlOlbY71eMuugtsVGp10yD4f58vZc7N4e3qZTRdNFGBq4wFCCLoVtDYavAhWgEcwMkCrMPQZBiLpjUTv1xYoCC_NRqHdOCDRtkN2_78biWh1yHHv8nF1Oqr9AyiSWTU</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Effects of time-variant non-linear TSV parameters on transient analysis for signal integrity</title><source>IEEE Xplore All Conference Series</source><creator>Piersanti, S. ; de Paulis, F. ; Orlandi, A. ; Achkir, B. ; Fan, J.</creator><creatorcontrib>Piersanti, S. ; de Paulis, F. ; Orlandi, A. ; Achkir, B. ; Fan, J.</creatorcontrib><description>This paper looksat the impact of considering the exact or approximated values for the nonlinear depletion capacitance in a TSV equivalent circuit for transient analysis. Furthermore, the effects of the time variant and nonlinear behavior of the doped bulk silicon substrate on signal propagation and crosstalk are also studied.</description><identifier>ISSN: 2162-7673</identifier><identifier>ISBN: 1479966681</identifier><identifier>ISBN: 9781479966684</identifier><identifier>EISSN: 2640-7469</identifier><identifier>EISBN: 9781479966707</identifier><identifier>EISBN: 1479966703</identifier><identifier>DOI: 10.1109/APEMC.2015.7175241</identifier><language>eng</language><publisher>IEEE</publisher><subject>Capacitance ; Crosstalk ; Equivalent circuits ; Integrated circuit modeling ; Silicon ; Substrates ; Through-silicon vias</subject><ispartof>2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 2015, p.380-383</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/7175241$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,27925,54555,54932</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/7175241$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Piersanti, S.</creatorcontrib><creatorcontrib>de Paulis, F.</creatorcontrib><creatorcontrib>Orlandi, A.</creatorcontrib><creatorcontrib>Achkir, B.</creatorcontrib><creatorcontrib>Fan, J.</creatorcontrib><title>Effects of time-variant non-linear TSV parameters on transient analysis for signal integrity</title><title>2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)</title><addtitle>APEMC</addtitle><description>This paper looksat the impact of considering the exact or approximated values for the nonlinear depletion capacitance in a TSV equivalent circuit for transient analysis. Furthermore, the effects of the time variant and nonlinear behavior of the doped bulk silicon substrate on signal propagation and crosstalk are also studied.</description><subject>Capacitance</subject><subject>Crosstalk</subject><subject>Equivalent circuits</subject><subject>Integrated circuit modeling</subject><subject>Silicon</subject><subject>Substrates</subject><subject>Through-silicon vias</subject><issn>2162-7673</issn><issn>2640-7469</issn><isbn>1479966681</isbn><isbn>9781479966684</isbn><isbn>9781479966707</isbn><isbn>1479966703</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2015</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotkEtrQjEUhNMX1Fr_QLvJH7j2nNyYx1LEPsDSQm1XBYnxRFI0V5JQ8N_3Ql0NM98wi2HsDmGMCPZh-j5_nY0F4GSsUU-ExDM2stqg1NYqpUGfs4FQEhotlb1gNyegDF72AJVotNLtNRuV8gMAAgBRmQH7nodAvhbeBV7jnppfl6NLlacuNbuYyGW-_PjiB5fdnirlvpl4zS6VSH3NJbc7llh46DIvcdtbHlOlbY71eMuugtsVGp10yD4f58vZc7N4e3qZTRdNFGBq4wFCCLoVtDYavAhWgEcwMkCrMPQZBiLpjUTv1xYoCC_NRqHdOCDRtkN2_78biWh1yHHv8nF1Oqr9AyiSWTU</recordid><startdate>20150501</startdate><enddate>20150501</enddate><creator>Piersanti, S.</creator><creator>de Paulis, F.</creator><creator>Orlandi, A.</creator><creator>Achkir, B.</creator><creator>Fan, J.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>20150501</creationdate><title>Effects of time-variant non-linear TSV parameters on transient analysis for signal integrity</title><author>Piersanti, S. ; de Paulis, F. ; Orlandi, A. ; Achkir, B. ; Fan, J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i208t-c00fff732eb870c2f920c1084f0361f8701fee4c841ccb90ef2c48d619da0e233</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Capacitance</topic><topic>Crosstalk</topic><topic>Equivalent circuits</topic><topic>Integrated circuit modeling</topic><topic>Silicon</topic><topic>Substrates</topic><topic>Through-silicon vias</topic><toplevel>online_resources</toplevel><creatorcontrib>Piersanti, S.</creatorcontrib><creatorcontrib>de Paulis, F.</creatorcontrib><creatorcontrib>Orlandi, A.</creatorcontrib><creatorcontrib>Achkir, B.</creatorcontrib><creatorcontrib>Fan, J.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Piersanti, S.</au><au>de Paulis, F.</au><au>Orlandi, A.</au><au>Achkir, B.</au><au>Fan, J.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Effects of time-variant non-linear TSV parameters on transient analysis for signal integrity</atitle><btitle>2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)</btitle><stitle>APEMC</stitle><date>2015-05-01</date><risdate>2015</risdate><spage>380</spage><epage>383</epage><pages>380-383</pages><issn>2162-7673</issn><eissn>2640-7469</eissn><isbn>1479966681</isbn><isbn>9781479966684</isbn><eisbn>9781479966707</eisbn><eisbn>1479966703</eisbn><abstract>This paper looksat the impact of considering the exact or approximated values for the nonlinear depletion capacitance in a TSV equivalent circuit for transient analysis. Furthermore, the effects of the time variant and nonlinear behavior of the doped bulk silicon substrate on signal propagation and crosstalk are also studied.</abstract><pub>IEEE</pub><doi>10.1109/APEMC.2015.7175241</doi><tpages>4</tpages></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | ISSN: 2162-7673 |
ispartof | 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 2015, p.380-383 |
issn | 2162-7673 2640-7469 |
language | eng |
recordid | cdi_ieee_primary_7175241 |
source | IEEE Xplore All Conference Series |
subjects | Capacitance Crosstalk Equivalent circuits Integrated circuit modeling Silicon Substrates Through-silicon vias |
title | Effects of time-variant non-linear TSV parameters on transient analysis for signal integrity |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T07%3A03%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_CHZPO&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Effects%20of%20time-variant%20non-linear%20TSV%20parameters%20on%20transient%20analysis%20for%20signal%20integrity&rft.btitle=2015%20Asia-Pacific%20Symposium%20on%20Electromagnetic%20Compatibility%20(APEMC)&rft.au=Piersanti,%20S.&rft.date=2015-05-01&rft.spage=380&rft.epage=383&rft.pages=380-383&rft.issn=2162-7673&rft.eissn=2640-7469&rft.isbn=1479966681&rft.isbn_list=9781479966684&rft_id=info:doi/10.1109/APEMC.2015.7175241&rft.eisbn=9781479966707&rft.eisbn_list=1479966703&rft_dat=%3Cieee_CHZPO%3E7175241%3C/ieee_CHZPO%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-i208t-c00fff732eb870c2f920c1084f0361f8701fee4c841ccb90ef2c48d619da0e233%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=7175241&rfr_iscdi=true |