Loading…

Effects of time-variant non-linear TSV parameters on transient analysis for signal integrity

This paper looksat the impact of considering the exact or approximated values for the nonlinear depletion capacitance in a TSV equivalent circuit for transient analysis. Furthermore, the effects of the time variant and nonlinear behavior of the doped bulk silicon substrate on signal propagation and...

Full description

Saved in:
Bibliographic Details
Main Authors: Piersanti, S., de Paulis, F., Orlandi, A., Achkir, B., Fan, J.
Format: Conference Proceeding
Language:English
Subjects:
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by
cites
container_end_page 383
container_issue
container_start_page 380
container_title
container_volume
creator Piersanti, S.
de Paulis, F.
Orlandi, A.
Achkir, B.
Fan, J.
description This paper looksat the impact of considering the exact or approximated values for the nonlinear depletion capacitance in a TSV equivalent circuit for transient analysis. Furthermore, the effects of the time variant and nonlinear behavior of the doped bulk silicon substrate on signal propagation and crosstalk are also studied.
doi_str_mv 10.1109/APEMC.2015.7175241
format conference_proceeding
fullrecord <record><control><sourceid>ieee_CHZPO</sourceid><recordid>TN_cdi_ieee_primary_7175241</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>7175241</ieee_id><sourcerecordid>7175241</sourcerecordid><originalsourceid>FETCH-LOGICAL-i208t-c00fff732eb870c2f920c1084f0361f8701fee4c841ccb90ef2c48d619da0e233</originalsourceid><addsrcrecordid>eNotkEtrQjEUhNMX1Fr_QLvJH7j2nNyYx1LEPsDSQm1XBYnxRFI0V5JQ8N_3Ql0NM98wi2HsDmGMCPZh-j5_nY0F4GSsUU-ExDM2stqg1NYqpUGfs4FQEhotlb1gNyegDF72AJVotNLtNRuV8gMAAgBRmQH7nodAvhbeBV7jnppfl6NLlacuNbuYyGW-_PjiB5fdnirlvpl4zS6VSH3NJbc7llh46DIvcdtbHlOlbY71eMuugtsVGp10yD4f58vZc7N4e3qZTRdNFGBq4wFCCLoVtDYavAhWgEcwMkCrMPQZBiLpjUTv1xYoCC_NRqHdOCDRtkN2_78biWh1yHHv8nF1Oqr9AyiSWTU</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Effects of time-variant non-linear TSV parameters on transient analysis for signal integrity</title><source>IEEE Xplore All Conference Series</source><creator>Piersanti, S. ; de Paulis, F. ; Orlandi, A. ; Achkir, B. ; Fan, J.</creator><creatorcontrib>Piersanti, S. ; de Paulis, F. ; Orlandi, A. ; Achkir, B. ; Fan, J.</creatorcontrib><description>This paper looksat the impact of considering the exact or approximated values for the nonlinear depletion capacitance in a TSV equivalent circuit for transient analysis. Furthermore, the effects of the time variant and nonlinear behavior of the doped bulk silicon substrate on signal propagation and crosstalk are also studied.</description><identifier>ISSN: 2162-7673</identifier><identifier>ISBN: 1479966681</identifier><identifier>ISBN: 9781479966684</identifier><identifier>EISSN: 2640-7469</identifier><identifier>EISBN: 9781479966707</identifier><identifier>EISBN: 1479966703</identifier><identifier>DOI: 10.1109/APEMC.2015.7175241</identifier><language>eng</language><publisher>IEEE</publisher><subject>Capacitance ; Crosstalk ; Equivalent circuits ; Integrated circuit modeling ; Silicon ; Substrates ; Through-silicon vias</subject><ispartof>2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 2015, p.380-383</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/7175241$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,27925,54555,54932</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/7175241$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Piersanti, S.</creatorcontrib><creatorcontrib>de Paulis, F.</creatorcontrib><creatorcontrib>Orlandi, A.</creatorcontrib><creatorcontrib>Achkir, B.</creatorcontrib><creatorcontrib>Fan, J.</creatorcontrib><title>Effects of time-variant non-linear TSV parameters on transient analysis for signal integrity</title><title>2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)</title><addtitle>APEMC</addtitle><description>This paper looksat the impact of considering the exact or approximated values for the nonlinear depletion capacitance in a TSV equivalent circuit for transient analysis. Furthermore, the effects of the time variant and nonlinear behavior of the doped bulk silicon substrate on signal propagation and crosstalk are also studied.</description><subject>Capacitance</subject><subject>Crosstalk</subject><subject>Equivalent circuits</subject><subject>Integrated circuit modeling</subject><subject>Silicon</subject><subject>Substrates</subject><subject>Through-silicon vias</subject><issn>2162-7673</issn><issn>2640-7469</issn><isbn>1479966681</isbn><isbn>9781479966684</isbn><isbn>9781479966707</isbn><isbn>1479966703</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2015</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotkEtrQjEUhNMX1Fr_QLvJH7j2nNyYx1LEPsDSQm1XBYnxRFI0V5JQ8N_3Ql0NM98wi2HsDmGMCPZh-j5_nY0F4GSsUU-ExDM2stqg1NYqpUGfs4FQEhotlb1gNyegDF72AJVotNLtNRuV8gMAAgBRmQH7nodAvhbeBV7jnppfl6NLlacuNbuYyGW-_PjiB5fdnirlvpl4zS6VSH3NJbc7llh46DIvcdtbHlOlbY71eMuugtsVGp10yD4f58vZc7N4e3qZTRdNFGBq4wFCCLoVtDYavAhWgEcwMkCrMPQZBiLpjUTv1xYoCC_NRqHdOCDRtkN2_78biWh1yHHv8nF1Oqr9AyiSWTU</recordid><startdate>20150501</startdate><enddate>20150501</enddate><creator>Piersanti, S.</creator><creator>de Paulis, F.</creator><creator>Orlandi, A.</creator><creator>Achkir, B.</creator><creator>Fan, J.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>20150501</creationdate><title>Effects of time-variant non-linear TSV parameters on transient analysis for signal integrity</title><author>Piersanti, S. ; de Paulis, F. ; Orlandi, A. ; Achkir, B. ; Fan, J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i208t-c00fff732eb870c2f920c1084f0361f8701fee4c841ccb90ef2c48d619da0e233</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Capacitance</topic><topic>Crosstalk</topic><topic>Equivalent circuits</topic><topic>Integrated circuit modeling</topic><topic>Silicon</topic><topic>Substrates</topic><topic>Through-silicon vias</topic><toplevel>online_resources</toplevel><creatorcontrib>Piersanti, S.</creatorcontrib><creatorcontrib>de Paulis, F.</creatorcontrib><creatorcontrib>Orlandi, A.</creatorcontrib><creatorcontrib>Achkir, B.</creatorcontrib><creatorcontrib>Fan, J.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Piersanti, S.</au><au>de Paulis, F.</au><au>Orlandi, A.</au><au>Achkir, B.</au><au>Fan, J.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Effects of time-variant non-linear TSV parameters on transient analysis for signal integrity</atitle><btitle>2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)</btitle><stitle>APEMC</stitle><date>2015-05-01</date><risdate>2015</risdate><spage>380</spage><epage>383</epage><pages>380-383</pages><issn>2162-7673</issn><eissn>2640-7469</eissn><isbn>1479966681</isbn><isbn>9781479966684</isbn><eisbn>9781479966707</eisbn><eisbn>1479966703</eisbn><abstract>This paper looksat the impact of considering the exact or approximated values for the nonlinear depletion capacitance in a TSV equivalent circuit for transient analysis. Furthermore, the effects of the time variant and nonlinear behavior of the doped bulk silicon substrate on signal propagation and crosstalk are also studied.</abstract><pub>IEEE</pub><doi>10.1109/APEMC.2015.7175241</doi><tpages>4</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier ISSN: 2162-7673
ispartof 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 2015, p.380-383
issn 2162-7673
2640-7469
language eng
recordid cdi_ieee_primary_7175241
source IEEE Xplore All Conference Series
subjects Capacitance
Crosstalk
Equivalent circuits
Integrated circuit modeling
Silicon
Substrates
Through-silicon vias
title Effects of time-variant non-linear TSV parameters on transient analysis for signal integrity
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T07%3A03%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_CHZPO&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Effects%20of%20time-variant%20non-linear%20TSV%20parameters%20on%20transient%20analysis%20for%20signal%20integrity&rft.btitle=2015%20Asia-Pacific%20Symposium%20on%20Electromagnetic%20Compatibility%20(APEMC)&rft.au=Piersanti,%20S.&rft.date=2015-05-01&rft.spage=380&rft.epage=383&rft.pages=380-383&rft.issn=2162-7673&rft.eissn=2640-7469&rft.isbn=1479966681&rft.isbn_list=9781479966684&rft_id=info:doi/10.1109/APEMC.2015.7175241&rft.eisbn=9781479966707&rft.eisbn_list=1479966703&rft_dat=%3Cieee_CHZPO%3E7175241%3C/ieee_CHZPO%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-i208t-c00fff732eb870c2f920c1084f0361f8701fee4c841ccb90ef2c48d619da0e233%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=7175241&rfr_iscdi=true