20 GHz bandwidth of lasers flip-chip-mounted on microstructured carriers with integrated electrical waveguides

A flip-chip-mounting scheme for high-speed lasers has been realised. The mounting scheme involves a microstructured silicon carrier with integrated membrane transmission lines and self-aligning solder bumps.

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Bibliographic Details
Main Authors: Ahlfeldt, H., Holm, J., Lindgren, S., Backlin, L., Vieider, C., Klinga, T., Kerzar, B., Nilsson, M., Svensson, M., Nilsson, S., Kjebon, O., Schatz, R.
Format: Conference Proceeding
Language:English
Subjects:
Bandwidth
Biomembranes
Etching
Fiber lasers
Laser modes
Laser theory
Semiconductor lasers
Silicon
Transmission line measurements
Transmission line theory
Online Access:Request full text
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Description
Summary:A flip-chip-mounting scheme for high-speed lasers has been realised. The mounting scheme involves a microstructured silicon carrier with integrated membrane transmission lines and self-aligning solder bumps.
DOI:10.1109/ECOC.1998.732504