Design and fabrication of a monolithic high-density probe card for high-frequency on-wafer testing

A novel probe card structure for high-density, high-frequency applications is described. Conventional probe tips are replaced by compliant, multilayer cantilever beams fabricated monolithically on a silicon wafer, which, if desired, can include active circuitry elements. All fabrication steps are ba...

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Main Authors: Hong, S., Lee, K., Bravman, J.C.
Format: Conference Proceeding
Language:English
Subjects:
Circuits
Fabrication
Force control
Micromachining
Nonhomogeneous media
Numerical simulation
Probes
Silicon
Stress control
Structural beams
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Lee, K.
Bravman, J.C.
description A novel probe card structure for high-density, high-frequency applications is described. Conventional probe tips are replaced by compliant, multilayer cantilever beams fabricated monolithically on a silicon wafer, which, if desired, can include active circuitry elements. All fabrication steps are based on standard IC processing and micromachining technologies. The mechanical and electrical characterizations of the probe card structure, based upon numerical simulations, are summarized. The principal findings are: (1) sufficient elastic deflection (>50 mu m) of a multilayer probe tip can be obtained by controlling the residual stresses in each film; (2) resisting forces produced by the elastic deformation of the beam can generate stable and relatively low contact resistances (
doi_str_mv 10.1109/IEDM.1989.74281
format conference_proceeding
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identifier ISSN: 0163-1918
ispartof International Technical Digest on Electron Devices Meeting, 1989, p.289-292
issn 0163-1918
2156-017X
language eng
recordid cdi_ieee_primary_74281
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Circuits
Fabrication
Force control
Micromachining
Nonhomogeneous media
Numerical simulation
Probes
Silicon
Stress control
Structural beams
title Design and fabrication of a monolithic high-density probe card for high-frequency on-wafer testing
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