A Multilayer LTCC Solution for Integrating 5G Access Point Antenna Modules

An integrated solution for the development of multilayer antenna modules for fifth-generation (5G) communications, based on low temperature cofired ceramic (LTCC), is presented. The design exploits the 3-D integration capabilities of the LTCC process, enabling the realization of a full-corporate fee...

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Bibliographic Details
Published in:IEEE transactions on microwave theory and techniques 2016-07, Vol.64 (7), p.2272-2283
Main Authors: Foglia Manzillo, Francesco, Ettorre, Mauro, Lahti, Markku S., Kautio, Kari T., Lelaidier, Delphine, Seguenot, Eric, Sauleau, Ronan
Format: Article
Language:English
Subjects:
5G mobile communication
Antenna-in-package (AiP)
Attenuation
Broadband antennas
Computer Science
corporate feed networks (CFNs)
Electronics
Engineering Sciences
Feeds
fifth-generation (5G)
low temperature cofired ceramic (LTCC)
millimeter-wave (mm-wave) antennas
mm-wave technologies
Networking and Internet Architecture
Nonhomogeneous media
Substrates
transverse electromagnetic (TEM) waveguides
Wireless networks
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Summary:An integrated solution for the development of multilayer antenna modules for fifth-generation (5G) communications, based on low temperature cofired ceramic (LTCC), is presented. The design exploits the 3-D integration capabilities of the LTCC process, enabling the realization of a full-corporate feed network (CFN) in vertical configuration. A novel implementation of the CFN employing dielectric-embedded parallel plate waveguides (PPWs) is proposed. The PPW lines are delimited by via-rows. As opposed to standard substrate-integrated waveguide feed networks, guided fields are orthogonal to the via-rows and propagate along the vertical axis of the structure. The CFN feeds four long slots, without any coupling structure, and provides broadband operation. The final prototype comprises 18 LTCC tapes, with a total thickness of 3.4 mm. The measured -10-dB impedance bandwidth spans from 51.2 to 66 GHz (>25.2%). The module generates a fixed broadside beam, but multibeam operation in H-plane can be easily achieved. In the 50-66-GHz band, the peak gain is 14.25 dBi and the average first side-lobe level in H-plane is -20.6 dB. The proposed technology and the design concept are suited for highly integrated millimeterwave systems, such as access points in the future V-band high data-rate wireless networks.
ISSN:0018-9480
1557-9670
DOI:10.1109/TMTT.2016.2574313