A Multistep DRIE Process for Complex Terahertz Waveguide Components

A silicon deep reactive-ion etching (DRIE) process has been developed, using multiple SiO 2 masks to enable multidepth waveguide features with ±2% tolerance. The unique capability of this process is demonstrated by designing, fabricating, and testing an orthomode transducer working in the 500-600 GH...

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Published in:IEEE transactions on terahertz science and technology 2016-09, Vol.6 (5), p.690-695
Main Authors: Jung-Kubiak, Cecile, Reck, Theodore J., Siles, Jose V., Lin, Robert, Choonsup Lee, Gill, John, Cooper, Ken, Mehdi, Imran, Chattopadhyay, Goutam
Format: Article
Language:English
Subjects:
Deep reactive-ion etching (DRIE)
Etching
Frequency ranges
Loss measurement
Metals
orthomode transducer (OMT)
Packages
Quadratures
Resists
Silicon
silicon dioxide (SiO2)
silicon micromachining
submillimeter waves
terahertz (THz)
Tolerances
Transducers
Waveguide components
Waveguides
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cited_by cdi_FETCH-LOGICAL-c440t-72ca1993c7c5250c16288b07389b7395b84915a40620d1bc117e0da5465a39b93
cites cdi_FETCH-LOGICAL-c440t-72ca1993c7c5250c16288b07389b7395b84915a40620d1bc117e0da5465a39b93
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container_issue 5
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container_title IEEE transactions on terahertz science and technology
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creator Jung-Kubiak, Cecile
Reck, Theodore J.
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Choonsup Lee
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Chattopadhyay, Goutam
description A silicon deep reactive-ion etching (DRIE) process has been developed, using multiple SiO 2 masks to enable multidepth waveguide features with ±2% tolerance. The unique capability of this process is demonstrated by designing, fabricating, and testing an orthomode transducer working in the 500-600 GHz frequency range. Straight waveguide measurements are also performed to characterize the losses associated with the multistep DRIE process, giving results slightly better than expected for metal-machined waveguides. This process enables the integration of multiple terahertz waveguide components such as mixers, multipliers, quadrature hybrids, and polarization twists onto a single silicon package.
doi_str_mv 10.1109/TTHZ.2016.2593793
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source IEEE Electronic Library (IEL) Journals
subjects Deep reactive-ion etching (DRIE)
Etching
Frequency ranges
Loss measurement
Metals
orthomode transducer (OMT)
Packages
Quadratures
Resists
Silicon
silicon dioxide (SiO2)
silicon micromachining
submillimeter waves
terahertz (THz)
Tolerances
Transducers
Waveguide components
Waveguides
title A Multistep DRIE Process for Complex Terahertz Waveguide Components
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