Implementation of Advanced Micro-Interconnection Technologies on a Thin-Film Multichip Module

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Bibliographic Details
Main Authors: Interrante, M.J., Clearfield, H.M., Beckham, K.F., Economikos, L.
Format: Conference Proceeding
Language:English
Subjects:
Bonding forces
Dielectric substrates
Fiber lasers
Flip chip
Lead
Multichip modules
Power lasers
Testing
Transistors
Wire
Online Access:Request full text
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DOI:10.1109/ICMCM.1994.753531